Steven M. Buchoff

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Baltimore, MD, US

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Patents Grantslast 30 patents

Information Patent Grant
Encapsulated silicidation for improved SiC processing and device yield
- Patent number 7,790,616
- Issue date Sep 7, 2010
- Northrop Grumman Systems Corporation
- Steven Mark Buchoff
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Encapsulated silicidation for improved SiC processing and device yield
- Publication number 20090057906
- Publication date Mar 5, 2009
- Steven Mark Buchoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TUNGSTEN INTERCONNECT SUPER STRUCTURE FOR SEMICONDUCTOR POWER DEVICES
- Publication number 20080128913
- Publication date Jun 5, 2008
- NORTHROP GRUMMAN SYSTEMS CORPORATION
- Li-Shu Chen
- H01 - BASIC ELECTRIC ELEMENTS