Steven O. Dunford

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Missouri City, TX, US

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Patents Grantslast 30 patents

Information Patent Grant
Additive manufacturing process of 3D electronic substrate
- Patent number 12,226,822
- Issue date Feb 18, 2025
- Schlumberger Technology Corporation
- Steven O. Dunford
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
3D-printed ceramics with conductor infusion for ultra-high-speed el...
- Patent number 11,770,906
- Issue date Sep 26, 2023
- Schlumberger Technology Corporation
- John Michael Beshears
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Additive manufactured 3D electronic substrate
- Patent number 11,765,839
- Issue date Sep 19, 2023
- Schlumberger Technology Corporation
- Steven O. Dunford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder joints on nickel surface finishes without gold plating
- Patent number 11,676,926
- Issue date Jun 13, 2023
- Schlumberger Technology Corporation
- Mark Alex Kostinovsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection of copper surfaces using copper sintering material
- Patent number 11,329,023
- Issue date May 10, 2022
- Schlumberger Technology Corporation
- Mark Alex Kostinovsky
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ADDITIVE MANUFACTURED 3D ELECTRONIC SUBSTRATE
- Publication number 20230381863
- Publication date Nov 30, 2023
- SCHLUMBERGER TECHNOLOGY CORPORATION
- Steven O. Dunford
- B22 - CASTING POWDER METALLURGY
Information Patent Application
3D-PRINTED CERAMICS WITH CONDUCTOR INFUSION FOR ULTRA-HIGH-SPEED EL...
- Publication number 20230069147
- Publication date Mar 2, 2023
- SCHLUMBERGER TECHNOLOGY CORPORATION
- John Michael Beshears
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER JOINTS ON NICKEL SURFACE FINISHES WITHOUT GOLD PLATING
- Publication number 20220059489
- Publication date Feb 24, 2022
- SCHLUMBERGER TECHNOLOGY CORPORATION
- Mark Alex Kostinovsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION OF COPPER SURFACES USING COPPER SINTERING MATERIAL
- Publication number 20210320082
- Publication date Oct 14, 2021
- SCHLUMBERGER TECHNOLOGY CORPORATION
- Mark Alex Kostinovsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADDITIVE MANUFACTURED 3D ELECTRONIC SUBSTRATE
- Publication number 20200120813
- Publication date Apr 16, 2020
- SCHLUMBERGER TECHNOLOGY CORPORATION
- Steven O. Dunford
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR