Steven O. Dunford

Person

Lewisville, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Composite layer for an electronic device
- Patent number 7,881,068
- Issue date Feb 1, 2011
- Nokia Corporation
- Ramin Vatanparast
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method for manufacturing a composite layer for an electronic device
- Patent number 7,523,546
- Issue date Apr 28, 2009
- Nokia Corporation
- Ramin Vatanparast
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Conductive pedestal on pad for leadless chip carrier (LCC) standoff
- Patent number 6,802,119
- Issue date Oct 12, 2004
- Texas Instruments Incorporated
- Steven O. Dunford
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive pedestal on pad for leadless chip carrier (LCC) standoff
- Patent number 6,472,611
- Issue date Oct 29, 2002
- Texax Instruments Incorporated
- Steven O. Dunford
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING A LAMINATE COVER, LAMINATE PROTECTIVE LAYE...
- Publication number 20090120672
- Publication date May 14, 2009
- Nokia Corporation
- Ramin Vatanparast
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Flexible optical illumination system
- Publication number 20070243844
- Publication date Oct 18, 2007
- Nokia Corporation
- Robert Cunningham
- G02 - OPTICS
Information Patent Application
Power generating display device
- Publication number 20070080925
- Publication date Apr 12, 2007
- Nokia Corporation
- Zoran Radivojevic
- G02 - OPTICS
Information Patent Application
Method for manufacturing a laminate cover, laminate protective laye...
- Publication number 20060248713
- Publication date Nov 9, 2006
- Nokia Corporation
- Ramin Vatanparast
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Lead-free solder alloys and methods of making same
- Publication number 20040258556
- Publication date Dec 23, 2004
- Nokia Corporation
- Choong-Un Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Conductive pedestal on pad for leadless chip carrier (LCC) standoff
- Publication number 20030008434
- Publication date Jan 9, 2003
- Steven O. Dunford
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Package level pre-applied underfills for thermo-mechanical reliabil...
- Publication number 20020162679
- Publication date Nov 7, 2002
- Nael Hannan
- H01 - BASIC ELECTRIC ELEMENTS

Steven O. Dunford

Person

Patents Grantslast 30 patents

Composite layer for an electronic device

Method for manufacturing a composite layer for an electronic device

Conductive pedestal on pad for leadless chip carrier (LCC) standoff

Conductive pedestal on pad for leadless chip carrier (LCC) standoff

Patents Applicationslast 30 patents

METHOD FOR MANUFACTURING A LAMINATE COVER, LAMINATE PROTECTIVE LAYE...

Flexible optical illumination system

Power generating display device

Method for manufacturing a laminate cover, laminate protective laye...

Lead-free solder alloys and methods of making same

Conductive pedestal on pad for leadless chip carrier (LCC) standoff

Package level pre-applied underfills for thermo-mechanical reliabil...