Steven R. Boyle

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Santa Clara, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
EMI heatspreader/lid for integrated circuit packages
- Patent number 6,943,436
- Issue date Sep 13, 2005
- Sun Microsystems, Inc.
- Sergiu Radu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit package with EMI containment features
- Patent number 6,573,590
- Issue date Jun 3, 2003
- Sun Microsystems, Inc.
- Sergiu Radu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a multi-layer to package
- Patent number 5,499,445
- Issue date Mar 19, 1996
- Intergraph Corporation
- Steven R. Boyle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layered integrated circuit package with improved high frequen...
- Patent number 5,338,970
- Issue date Aug 16, 1994
- Intergraph Corporation
- Steven R. Boyle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pad scheme
- Patent number 4,990,996
- Issue date Feb 5, 1991
- Zilog, Inc.
- Niraj Kumar
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
EMI heatspreader/lid for integrated circuit packages
- Publication number 20040135239
- Publication date Jul 15, 2004
- Sergiu Radu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR