Steven R. Codding

Person

Underhill Center, VT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method to recover patterned semiconductor wafers for rework
- Patent number 8,034,718
- Issue date Oct 11, 2011
- International Business Machines Corporation
- Steven R. Codding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of thinning a semiconductor substrate
- Patent number 7,932,614
- Issue date Apr 26, 2011
- International Business Machines Corporation
- Steven R. Codding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of thinning a semiconductor substrate
- Patent number 7,867,876
- Issue date Jan 11, 2011
- International Business Machines Corporation
- Steven R. Codding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for recycling of ion implantation monitor wafers
- Patent number 7,732,303
- Issue date Jun 8, 2010
- International Business Machines Corporation
- Steven Ross Codding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Recycling of ion implantation monitor wafers
- Patent number 7,700,488
- Issue date Apr 20, 2010
- International Business Machines Corporation
- Steven Ross Codding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to remove circuit patterns from a wafer
- Patent number 7,666,689
- Issue date Feb 23, 2010
- International Business Machines Corporation
- Steven R. Codding
- B24 - GRINDING POLISHING
Information Patent Grant
Tape removal in semiconductor structure fabrication
- Patent number 7,572,739
- Issue date Aug 11, 2009
- International Business Machines Corporation
- Steven R. Codding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon wafer thinning end point method
- Patent number 7,498,236
- Issue date Mar 3, 2009
- International Business Machines Corporation
- Steven R. Codding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Application of a thermally conductive thin film to a wafer backside...
- Patent number 7,387,911
- Issue date Jun 17, 2008
- International Business Machines Corporation
- David M Audette
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rework process for removing residual UV adhesive from C4 wafer surf...
- Patent number 7,348,216
- Issue date Mar 25, 2008
- International Business Machines Corporation
- Steven R. Codding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of polishing C4 molybdenum masks to remove molybdenum peaks
- Patent number 7,025,891
- Issue date Apr 11, 2006
- International Business Machines Corporation
- Steven R. Codding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF THINNING A SEMICONDUCTOR SUBSTRATE
- Publication number 20110031620
- Publication date Feb 10, 2011
- International Business Machines Corporation
- Steven R. Codding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF THINNING A SEMICONDUCTOR SUBSTRATE
- Publication number 20100155936
- Publication date Jun 24, 2010
- International Business Machines Corporation
- Steven R. Codding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR RECYCLING OF ION IMPLANTATION MONITOR WAFERS
- Publication number 20090197400
- Publication date Aug 6, 2009
- Steven Ross Codding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECYCLING OF ION IMPLANTATION MONITOR WAFERS
- Publication number 20080171439
- Publication date Jul 17, 2008
- Steven Ross Codding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO RECOVER PATTERNED SEMICONDUCTOR WAFERS FOR REWORK
- Publication number 20080138989
- Publication date Jun 12, 2008
- Steven R. Codding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method to Remove Circuit Patterns from a Wafer
- Publication number 20080139088
- Publication date Jun 12, 2008
- Steven R. Codding
- B24 - GRINDING POLISHING
Information Patent Application
SILICON WAFER THINNING END POINT METHOD
- Publication number 20080124896
- Publication date May 29, 2008
- International Business Machines Corporation
- Steven R. Codding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR PROTECTING IMAGE SENSOR WAFERS FROM FRONT SURFACE DAMAG...
- Publication number 20080113456
- Publication date May 15, 2008
- International Business Machines Corporation
- Steven R. Codding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Rework process for removing residual UV adhesive from C4 wafer surf...
- Publication number 20070077752
- Publication date Apr 5, 2007
- International Business Machines Corporation
- Steven R. Codding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CLEANING PARTICULATE FOREIGN MATTER FROM THE SURFACES OF...
- Publication number 20070054115
- Publication date Mar 8, 2007
- International Business Machines Corporation
- Steven R. Codding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TAPE REMOVAL IN SEMICONDUCTOR STRUCTURE FABRICATION
- Publication number 20060163204
- Publication date Jul 27, 2006
- International Business Machines Corporation
- Steven R. Codding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Application of a thermally conductive thin film to a wafer backside...
- Publication number 20060105547
- Publication date May 18, 2006
- International Business Machines Corporation
- David M. Audette
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF POLISHING C4 MOLYBDENUM MASKS TO REMOVE MOLYBDENUM PEAKS
- Publication number 20050045591
- Publication date Mar 3, 2005
- International Business Machines Corporation
- Steven R. Codding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Steven R. Codding

Person

Patents Grantslast 30 patents

Method to recover patterned semiconductor wafers for rework

Method of thinning a semiconductor substrate

Method of thinning a semiconductor substrate

Method for recycling of ion implantation monitor wafers

Recycling of ion implantation monitor wafers

Method to remove circuit patterns from a wafer

Tape removal in semiconductor structure fabrication

Silicon wafer thinning end point method

Application of a thermally conductive thin film to a wafer backside...

Rework process for removing residual UV adhesive from C4 wafer surf...

Method of polishing C4 molybdenum masks to remove molybdenum peaks

Patents Applicationslast 30 patents

METHOD OF THINNING A SEMICONDUCTOR SUBSTRATE

METHOD OF THINNING A SEMICONDUCTOR SUBSTRATE

METHOD FOR RECYCLING OF ION IMPLANTATION MONITOR WAFERS

RECYCLING OF ION IMPLANTATION MONITOR WAFERS

METHOD TO RECOVER PATTERNED SEMICONDUCTOR WAFERS FOR REWORK

Method to Remove Circuit Patterns from a Wafer

SILICON WAFER THINNING END POINT METHOD

PROCESS FOR PROTECTING IMAGE SENSOR WAFERS FROM FRONT SURFACE DAMAG...

Rework process for removing residual UV adhesive from C4 wafer surf...

METHOD FOR CLEANING PARTICULATE FOREIGN MATTER FROM THE SURFACES OF...

TAPE REMOVAL IN SEMICONDUCTOR STRUCTURE FABRICATION

Application of a thermally conductive thin film to a wafer backside...

METHOD OF POLISHING C4 MOLYBDENUM MASKS TO REMOVE MOLYBDENUM PEAKS