Steven R. Shiffer

Person

Pearl City, IL, US

People

Patents Grantslast 30 patents

Information Patent Grant
High temperature package flip-chip bonding to ceramic
- Patent number 7,408,243
- Issue date Aug 5, 2008
- Honeywell International Inc.
- Stephen R. Shiffer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Torque sensor packaging systems and methods
- Patent number 7,395,724
- Issue date Jul 8, 2008
- Honeywell International Inc.
- Scott L. Bunyer
- G01 - MEASURING TESTING
Information Patent Grant
Pressure sensor
- Patent number 7,318,351
- Issue date Jan 15, 2008
- Honeywell International Inc.
- Cornel P. Cobianu
- G01 - MEASURING TESTING
Information Patent Grant
Wireless torque sensor
- Patent number 7,307,517
- Issue date Dec 11, 2007
- Honeywell International Inc.
- James Z T Liu
- G01 - MEASURING TESTING
Information Patent Grant
Multiple wireless sensors for dialysis application
- Patent number 7,219,021
- Issue date May 15, 2007
- Honeywell International Inc.
- James Z T Liu
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Calibrated pressure sensor
- Patent number 7,216,048
- Issue date May 8, 2007
- Honeywell International Inc.
- Tzu-Yu Wang
- G01 - MEASURING TESTING
Information Patent Grant
Torque sensor integrated with engine components
- Patent number 7,201,044
- Issue date Apr 10, 2007
- Honeywell International, Inc.
- Scott L. Bunyer
- G01 - MEASURING TESTING
Information Patent Grant
Plastic leadframe and compliant fastener
- Patent number 7,193,300
- Issue date Mar 20, 2007
- Honeywell International Inc.
- Stephen R. Shiffer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wireless capacitance pressure sensor
- Patent number 7,181,975
- Issue date Feb 27, 2007
- Honeywell International
- Alistair D. Bradley
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Plastic lead frames utilizing reel-to-reel processing
- Patent number 7,134,197
- Issue date Nov 14, 2006
- Honeywell International Inc.
- Stephen R. Shiffer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip metal bonding to plastic leadframe
- Patent number 7,112,873
- Issue date Sep 26, 2006
- Honeywell International Inc.
- Stephen R. Shiffer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderless component packaging and mounting
- Patent number 7,061,076
- Issue date Jun 13, 2006
- Honeywell International Inc.
- Stephen R. Shiffer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
DISPOSABLE PRESSURE SENSOR SYSTEMS AND PACKAGES THEREFOR
- Publication number 20110214504
- Publication date Sep 8, 2011
- Honeywell International Inc.
- Alistair D. Bradley
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
Thermal mass gas flow sensor and method of forming same
- Publication number 20070209433
- Publication date Sep 13, 2007
- Honeywell International Inc.
- Richard W. Gehman
- G01 - MEASURING TESTING
Information Patent Application
Disposable pressure sensor systems and packages therefor
- Publication number 20070197922
- Publication date Aug 23, 2007
- Honeywell International Inc.
- Alistair D. Bradley
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
High temperature package flip-chip bonding to ceramic
- Publication number 20070132076
- Publication date Jun 14, 2007
- Honeywell International Inc.
- Stephen R. Shiffer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Automotive plastic lead frame sensor
- Publication number 20070085179
- Publication date Apr 19, 2007
- Honeywell International Inc.
- Stephen R. Shiffer
- G01 - MEASURING TESTING
Information Patent Application
Pressure sensor
- Publication number 20070074577
- Publication date Apr 5, 2007
- Honeywell International Inc.
- Cornel P. Cobianu
- G01 - MEASURING TESTING
Information Patent Application
Torque sensor integrated with engine components
- Publication number 20070068235
- Publication date Mar 29, 2007
- Honeywell International Inc.
- Scott L. Bunyer
- G01 - MEASURING TESTING
Information Patent Application
Multiple wireless sensors for dialysis application
- Publication number 20070061089
- Publication date Mar 15, 2007
- Honeywell International Inc.
- James ZT Liu
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
Torque sensor packaging systems and methods
- Publication number 20070039396
- Publication date Feb 22, 2007
- Honeywell International Inc.
- Scott L. Bunyer
- G01 - MEASURING TESTING
Information Patent Application
One piece needle and diaphragm assembly
- Publication number 20070028697
- Publication date Feb 8, 2007
- Honeywell International Inc.
- Stephen R. Shiffer
- G01 - MEASURING TESTING
Information Patent Application
Wireless torque sensor
- Publication number 20070030134
- Publication date Feb 8, 2007
- Honeywell International Inc.
- James ZT Liu
- G01 - MEASURING TESTING
Information Patent Application
Plastic lead frame with snap-together circuitry
- Publication number 20070029649
- Publication date Feb 8, 2007
- Honeywell International Inc.
- Stephen R. Shiffer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Calibrated pressure sensor
- Publication number 20060161364
- Publication date Jul 20, 2006
- Tzu-Yu Wang
- G01 - MEASURING TESTING
Information Patent Application
Plastic leadframe and compliant fastener
- Publication number 20060057781
- Publication date Mar 16, 2006
- Honeywell International, Inc.
- Stephen R. Shiffer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flip chip metal bonding to plastic leadframe
- Publication number 20060049529
- Publication date Mar 9, 2006
- Honeywell International, Inc.
- Stephen R. Shiffer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metalized plastic seal
- Publication number 20060046337
- Publication date Mar 2, 2006
- Honeywell International Inc.
- Stephen R. Shiffer
- G01 - MEASURING TESTING
Information Patent Application
High temperature sensor sleeve
- Publication number 20060037394
- Publication date Feb 23, 2006
- Honeywell International, Inc.
- Stephen R. Shiffer
- G01 - MEASURING TESTING
Information Patent Application
Solderless component packaging and mounting
- Publication number 20060035410
- Publication date Feb 16, 2006
- Honeywell International, Inc.
- Stephen R. Shiffer
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Packaging assembly utilizing flip chip and conductive plastic traces
- Publication number 20050227417
- Publication date Oct 13, 2005
- Honeywell International Inc.
- Steven R. Shiffer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Micro-discharge sensor system
- Publication number 20050142035
- Publication date Jun 30, 2005
- Ulrich Bonne
- B82 - NANO-TECHNOLOGY
Information Patent Application
Plastic lead frames utilizing reel-to-reel processing
- Publication number 20050136569
- Publication date Jun 23, 2005
- Honeywell International, Inc.
- Stephen R. Shiffer
- H01 - BASIC ELECTRIC ELEMENTS

Steven R. Shiffer

Person

Patents Grantslast 30 patents

High temperature package flip-chip bonding to ceramic

Torque sensor packaging systems and methods

Pressure sensor

Wireless torque sensor

Multiple wireless sensors for dialysis application

Calibrated pressure sensor

Torque sensor integrated with engine components

Plastic leadframe and compliant fastener

Wireless capacitance pressure sensor

Plastic lead frames utilizing reel-to-reel processing

Flip chip metal bonding to plastic leadframe

Solderless component packaging and mounting

Patents Applicationslast 30 patents

DISPOSABLE PRESSURE SENSOR SYSTEMS AND PACKAGES THEREFOR

Thermal mass gas flow sensor and method of forming same

Disposable pressure sensor systems and packages therefor

High temperature package flip-chip bonding to ceramic

Automotive plastic lead frame sensor

Pressure sensor

Torque sensor integrated with engine components

Multiple wireless sensors for dialysis application

Torque sensor packaging systems and methods

One piece needle and diaphragm assembly

Wireless torque sensor

Plastic lead frame with snap-together circuitry

Calibrated pressure sensor

Plastic leadframe and compliant fastener

Flip chip metal bonding to plastic leadframe

Metalized plastic seal

High temperature sensor sleeve

Solderless component packaging and mounting

Packaging assembly utilizing flip chip and conductive plastic traces

Micro-discharge sensor system

Plastic lead frames utilizing reel-to-reel processing