Steven R. Vandervoort

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Beaverton, OR, US

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Patents Grantslast 30 patents

Information Patent Grant
Socket cover with heat flow for surface mount solder reflow
- Patent number 8,622,278
- Issue date Jan 7, 2014
- Intel Corporation
- Victor Alvarez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
TECHNIQUES TO REDUCE SUBSTRATE REFLOW WARPAGE
- Publication number 20190103289
- Publication date Apr 4, 2019
- Intel Corporation
- Christopher David Combs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOCKET COVER WITH HEAT FLOW FOR SURFACE MOUNT SOLDER REFLOW
- Publication number 20140001243
- Publication date Jan 2, 2014
- Victor Alvarez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR