Steven Su

Person

Chung Ho City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method of making a wire support leadframe for a semiconductor device
- Patent number 10,811,343
- Issue date Oct 20, 2020
- Texas Instruments Incorporated
- Yuh-Harng Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire support for a leadframe
- Patent number 10,529,654
- Issue date Jan 7, 2020
- Texas Instruments Incorporated
- Yuh-Harng Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a wire support leadframe for a semiconductor device
- Patent number 10,229,868
- Issue date Mar 12, 2019
- Texas Instruments Incorporated
- Yuh-Harng Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device having multi-level leadframes configu...
- Patent number 10,211,132
- Issue date Feb 19, 2019
- Texas Instruments Incorporated
- Chia-Yu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire support for a leadframe
- Patent number 10,121,733
- Issue date Nov 6, 2018
- Texas Instruments Incorporated
- Yuh-Harng Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a leadframe with multi-level assembly...
- Patent number 9,922,908
- Issue date Mar 20, 2018
- Texas Instruments Incorporated
- Chia-Yu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planar leadframe substrate having a downset below within a die area
- Patent number 9,786,582
- Issue date Oct 10, 2017
- Texas Instruments Incorporated
- Chia-Yu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a wire support leadframe for a semiconductor device
- Patent number 9,627,331
- Issue date Apr 18, 2017
- Texas Instruments Incorporated
- Yuh-Harng Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Making a plurality of integrated circuit packages
- Patent number 9,363,901
- Issue date Jun 7, 2016
- Texas Instruments Incorporated
- Wen Yu Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Leadframe strip and leadframes
- Patent number 9,337,130
- Issue date May 10, 2016
- Texas Instruments Incorporated
- Wen Yu Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method Of Making A Wire Support Leadframe For A Semiconductor Device
- Publication number 20190172776
- Publication date Jun 6, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Yuh-Harng Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire Support For A Leadframe
- Publication number 20190027429
- Publication date Jan 24, 2019
- TEXAS INSTRUMENTS INCORPORATED
- YUH-HARNG CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A LEADFRAME WITH MULTI-LEVEL ASSEMBLY...
- Publication number 20180211905
- Publication date Jul 26, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Chia-Yu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method Of Making A Wire Support Leadframe For A Semiconductor Device
- Publication number 20180174950
- Publication date Jun 21, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Yuh-Harng Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLANAR LEADFRAME SUBSTRATE HAVING A DOWNSET BELOW WITHIN A DIE AREA
- Publication number 20170221799
- Publication date Aug 3, 2017
- TEXAS INSTRUMENTS INCORPORATED
- CHIA-YU CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire Support for a Leadframe
- Publication number 20170194236
- Publication date Jul 6, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Yuh-Harng Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A LEADFRAME WITH MULTI-LEVEL ASSEMBLY...
- Publication number 20170179007
- Publication date Jun 22, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Chia-Yu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAKING A PLURALITY OF INTEGRATED CIRCUIT PACKAGES
- Publication number 20160100490
- Publication date Apr 7, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Wen Yu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadframe Strip And Leadframes
- Publication number 20160027721
- Publication date Jan 28, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Wen Yu Lee
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Method of making a wire support leadframe for a semiconductor device

Wire support for a leadframe

Method of making a wire support leadframe for a semiconductor device

Packaged semiconductor device having multi-level leadframes configu...

Wire support for a leadframe

Semiconductor package having a leadframe with multi-level assembly...

Planar leadframe substrate having a downset below within a die area

Method of making a wire support leadframe for a semiconductor device

Making a plurality of integrated circuit packages

Leadframe strip and leadframes

Patents Applicationslast 30 patents

Method Of Making A Wire Support Leadframe For A Semiconductor Device

Wire Support For A Leadframe

SEMICONDUCTOR PACKAGE HAVING A LEADFRAME WITH MULTI-LEVEL ASSEMBLY...

Method Of Making A Wire Support Leadframe For A Semiconductor Device

PLANAR LEADFRAME SUBSTRATE HAVING A DOWNSET BELOW WITHIN A DIE AREA

Wire Support for a Leadframe

SEMICONDUCTOR PACKAGE HAVING A LEADFRAME WITH MULTI-LEVEL ASSEMBLY...

MAKING A PLURALITY OF INTEGRATED CIRCUIT PACKAGES

Leadframe Strip And Leadframes