Stewart A. Clark

Person

Irvine, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method for precision integrated circuit die singulation using diffe...
- Patent number RE43877
- Issue date Dec 25, 2012
- Aprolase Development Co., LLC
- David Ludwig
- 438 - Semiconductor device manufacturing: process
Information Patent Grant
Method for precision integrated circuit die singulation using diffe...
- Patent number 7,335,576
- Issue date Feb 26, 2008
- Irvine Sensors Corp.
- Ludwig David
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical spatial interconnect net
- Patent number 6,969,858
- Issue date Nov 29, 2005
- Northrop Grumman Corporation
- Stewart A. Clark
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Self-aligning contacts for stacked electronics
- Patent number 6,849,388
- Issue date Feb 1, 2005
- Northrop Grumman Corporation
- Stewart A. Clark
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Dynamically reconfigurable data processing system
- Patent number 5,617,318
- Issue date Apr 1, 1997
- Northrop Grumman Corporation
- Stewart A. Clark
- G01 - MEASURING TESTING
Information Patent Grant
Thermal imager incorporating electronics module having focal plane...
- Patent number 4,806,761
- Issue date Feb 21, 1989
- Irvine Sensors Corporation
- John C. Carson
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Detector array module fabrication process
- Patent number 4,672,737
- Issue date Jun 16, 1987
- Irvine Sensors Corporation
- John C. Carson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-density electronic processing package--structure and fabrication
- Patent number 4,646,128
- Issue date Feb 24, 1987
- Irvine Sensors Corporation
- John C. Carson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Detector array module-structure and fabrication
- Patent number 4,551,629
- Issue date Nov 5, 1985
- Irvine Sensors Corporation
- John C. Carson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-density electronic processing package-structure and fabrication
- Patent number 4,525,921
- Issue date Jul 2, 1985
- Irvine Sensors Corporation
- John C. Carson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Detector array focal plane configuration
- Patent number 4,403,238
- Issue date Sep 6, 1983
- Irvine Sensors Corporation
- Stewart A. Clark
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Stacked Physically Uncloneable Function Sense and Respond Module
- Publication number 20130141137
- Publication date Jun 6, 2013
- ISC8 Inc.
- Christian Krutzik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-layer photon counting electronic module
- Publication number 20110084212
- Publication date Apr 14, 2011
- Irvine Sensors Corporation
- Stewart Clark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for precision integrated circuit die singulation using diffe...
- Publication number 20060079072
- Publication date Apr 13, 2006
- Ludwig David
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Self-aligning contacts for stacked electronics
- Publication number 20040081920
- Publication date Apr 29, 2004
- Stewart A. Clark
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Optical spatial interconnect net
- Publication number 20040075057
- Publication date Apr 22, 2004
- Stewart A. Clark
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Stewart A. Clark

Person

Patents Grantslast 30 patents

Method for precision integrated circuit die singulation using diffe...

Method for precision integrated circuit die singulation using diffe...

Optical spatial interconnect net

Self-aligning contacts for stacked electronics

Dynamically reconfigurable data processing system

Thermal imager incorporating electronics module having focal plane...

Detector array module fabrication process

High-density electronic processing package--structure and fabrication

Detector array module-structure and fabrication

High-density electronic processing package-structure and fabrication

Detector array focal plane configuration

Patents Applicationslast 30 patents

Stacked Physically Uncloneable Function Sense and Respond Module

Multi-layer photon counting electronic module

Method for precision integrated circuit die singulation using diffe...

Self-aligning contacts for stacked electronics

Optical spatial interconnect net