Stuart E. Greer

Person

People

Patents Grantslast 30 patents

Information Patent Grant
Method of forming semiconductor device including interconnect barri...
- Patent number 6,713,381
- Issue date Mar 30, 2004
- Motorola, Inc.
- Alexander L. Barr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of formation
- Patent number 6,689,680
- Issue date Feb 10, 2004
- Motorola, Inc.
- Stuart E. Greer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming copper interconnection utilizing aluminum capping...
- Patent number 6,451,681
- Issue date Sep 17, 2002
- Motorola, Inc.
- Stuart E. Greer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a process for forming the semiconductor de...
- Patent number 6,346,469
- Issue date Feb 12, 2002
- Motorola, Inc.
- Stuart E. Greer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for multiplexed joining of solder bumps to various substrate...
- Patent number 6,117,759
- Issue date Sep 12, 2000
- Motorola Inc.
- Stuart E. Greer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming interconnect bumps on a semiconductor die
- Patent number 6,107,180
- Issue date Aug 22, 2000
- Motorola, Inc.
- Robert A. Munroe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for testing and burning-in a semiconductor wafer
- Patent number 5,597,737
- Issue date Jan 28, 1997
- Motorola Inc.
- Stuart E. Greer
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device solder bump having intrinsic potential for for...
- Patent number 5,470,787
- Issue date Nov 28, 1995
- Motorola, Inc.
- Stuart E. Greer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a temporary attachment between a semiconductor d...
- Patent number 5,468,655
- Issue date Nov 21, 1995
- Motorola, Inc.
- Stuart E. Greer
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor device and method of formation
- Publication number 20040094837
- Publication date May 20, 2004
- Stuart E. Greer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of formation
- Publication number 20030013290
- Publication date Jan 16, 2003
- Stuart E. Greer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of formation
- Publication number 20020093098
- Publication date Jul 18, 2002
- Alexander L. Barr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE CONDUCTIVE BUMP AND INTERCONNECT BARRIER
- Publication number 20020000665
- Publication date Jan 3, 2002
- ALEXANDER L. BARR
- H01 - BASIC ELECTRIC ELEMENTS

Stuart E. Greer

Person

Patents Grantslast 30 patents

Method of forming semiconductor device including interconnect barri...

Semiconductor device and method of formation

Method of forming copper interconnection utilizing aluminum capping...

Semiconductor device and a process for forming the semiconductor de...

Method for multiplexed joining of solder bumps to various substrate...

Method for forming interconnect bumps on a semiconductor die

Method for testing and burning-in a semiconductor wafer

Semiconductor device solder bump having intrinsic potential for for...

Method for forming a temporary attachment between a semiconductor d...

Patents Applicationslast 30 patents

Semiconductor device and method of formation

Semiconductor device and method of formation

Semiconductor device and method of formation

SEMICONDUCTOR DEVICE CONDUCTIVE BUMP AND INTERCONNECT BARRIER