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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor device, stacked semiconductor device and manufacturin...
Patent number
12,002,761
Issue date
Jun 4, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chih-Hang Tung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding method of package components and bonding apparatus
Patent number
11,955,378
Issue date
Apr 9, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Yi-Li Hsiao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device, stacked semiconductor device and manufacturin...
Patent number
11,456,256
Issue date
Sep 27, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Chih-Hang Tung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding method of package components and bonding apparatus
Patent number
11,443,981
Issue date
Sep 13, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Yi-Li Hsiao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding with pre-deoxide process and apparatus for performing the same
Patent number
11,342,302
Issue date
May 24, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and method for forming the same
Patent number
11,101,195
Issue date
Aug 24, 2021
Taiwan Semiconductor Manufacturing Co., Ltd
Tung-Liang Shao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip package structure and method for forming the same
Patent number
11,056,459
Issue date
Jul 6, 2021
Taiwan Semiconductor Manufacturing Co., Ltd
Chih-Hang Tung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solder bump stretching method
Patent number
10,163,835
Issue date
Dec 25, 2018
Taiwan Semiconductor Manufacturing Company, Ltd
Su-Chun Yang
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Metal post bonding using pre-fabricated metal posts
Patent number
10,034,390
Issue date
Jul 24, 2018
Taiwan Semiconductor Manufacturing Company, Ltd.
Yi-Li Hsiao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solder bump stretching method for forming a solder bump joint in a...
Patent number
9,978,709
Issue date
May 22, 2018
Taiwan Semiconductor Manufacturing Company, Ltd
Su-Chun Yang
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Thinning process using metal-assisted chemical etching
Patent number
9,893,046
Issue date
Feb 13, 2018
Taiwan Semiconductor Manufacturing Co., Ltd
Su-Chun Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solder bump stretching method and device for performing the same
Patent number
9,842,817
Issue date
Dec 12, 2017
Taiwan Semiconductor Manufacturing Company, Ltd
Su-Chun Yang
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Solder bump joint in a device including lamellar structures
Patent number
9,475,145
Issue date
Oct 25, 2016
Taiwan Semiconductor Manufacturing Company, Ltd.
Su-Chun Yang
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for manufacturing a plurality of metal posts
Patent number
9,263,407
Issue date
Feb 16, 2016
Taiwan Semiconductor Manufacturing Company, Ltd.
Yi-Li Hsiao
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Beam steering antenna structure
Patent number
9,166,288
Issue date
Oct 20, 2015
National Chiao Tung University
Ruey-Bing Hwang
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
Publication number
20240128178
Publication date
Apr 18, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Yu-Hung LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIE STACKING STRUCTURE, SEMICONDUCTOR PACKAGE AND FORMATION METHOD...
Publication number
20230369156
Publication date
Nov 16, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Su-Chun Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIE STACKING STRUCTURE, SEMICONDUCTOR PACKAGE AND MANUFACTURING MET...
Publication number
20230360993
Publication date
Nov 9, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Su-Chun Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
Publication number
20230207473
Publication date
Jun 29, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Hang TUNG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE, STACKED SEMICONDUCTOR DEVICE AND MANUFACTURIN...
Publication number
20220384352
Publication date
Dec 1, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Hang TUNG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING METHOD OF PACKAGE COMPONENTS AND BONDING APPARATUS
Publication number
20220367255
Publication date
Nov 17, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Yi-Li Hsiao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Bonding with Pre-Deoxide Process and Apparatus for Performing the Same
Publication number
20220285310
Publication date
Sep 8, 2022
Taiwan Semiconductor Manufacturing Co., Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE
Publication number
20210375724
Publication date
Dec 2, 2021
Taiwan Semiconductor Manufacturing Company, Ltd.
Tung-Liang SHAO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTR DEVICE, STACKED SEMICONDUCTOR DEVICE AND MANUFACTURING...
Publication number
20210375766
Publication date
Dec 2, 2021
Taiwan Semiconductor Manufacturing Co., Ltd.
Chih-Hang TUNG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE STRUCTURE WITH REDISTRIBUTION LAYER HAVING BONDING POR...
Publication number
20210335750
Publication date
Oct 28, 2021
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Hang TUNG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING METHOD OF PACKAGE COMPONENTS AND BONDING APPARATUS
Publication number
20210050251
Publication date
Feb 18, 2021
Taiwan Semiconductor Manufacturing Co., Ltd.
Yi-Li HSIAO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
Publication number
20200091039
Publication date
Mar 19, 2020
Taiwan Semiconductor Manufacturing Co., Ltd.
Tung-Liang SHAO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
Publication number
20200058614
Publication date
Feb 20, 2020
Taiwan Semiconductor Manufacturing Co., Ltd.
Chih-Hang TUNG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Bonding with Pre-Deoxide Process and Apparatus for Performing the Same
Publication number
20190326251
Publication date
Oct 24, 2019
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SOLDER BUMP STRETCHING METHOD
Publication number
20180108632
Publication date
Apr 19, 2018
Taiwan Semiconductor Manufacturing Company, Ltd.
Su-Chun YANG
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
THINNING PROCESS USING METAL-ASSISTED CHEMICAL ETCHING
Publication number
20180012880
Publication date
Jan 11, 2018
Taiwan Semiconductor Manufacturing Co., Ltd.
Su-Chun YANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
System and Method for Immersion Bonding
Publication number
20170330855
Publication date
Nov 16, 2017
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Hang Tung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SOLDER BUMP STRETCHING METHOD FOR FORMING A SOLDER BUMP JOINT IN A...
Publication number
20170012019
Publication date
Jan 12, 2017
Taiwan Semiconductor Manufacturing Company, Ltd.
Su-Chun YANG
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information
Patent Application
Metal Post Bonding Using Pre-Fabricated Metal Posts
Publication number
20160143157
Publication date
May 19, 2016
Taiwan Semiconductor Manufacturing Company, Ltd.
Yi-Li Hsiao
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SOLDER BUMP STRETCHING METHOD AND DEVICE FOR PERFORMING THE SAME
Publication number
20150079763
Publication date
Mar 19, 2015
Taiwan Semiconductor Manufacturing Company, Ltd.
Su-Chun YANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Metal Post Bonding Using Pre-Fabricated Metal Posts
Publication number
20140262470
Publication date
Sep 18, 2014
Yi-Li Hsiao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BEAM STEERING ANTENNA STRUCTURE
Publication number
20130234889
Publication date
Sep 12, 2013
NATIONAL CHIAO-TUNG UNIVERSITY
Ruey-Bing Hwang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SOLDER BUMP STRETCHING METHOD FOR FORMING A SOLDER BUMP JOINT IN A...
Publication number
20130221521
Publication date
Aug 29, 2013
Taiwan Semiconductor Manufacturing Company, Ltd.
Su-Chun Yang
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SOLDER BUMP STRETCHING METHOD
Publication number
20130221074
Publication date
Aug 29, 2013
Taiwan Semiconductor Manufacturing Company, Ltd.
Cheng-Chang WEI
H01 - BASIC ELECTRIC ELEMENTS