Su-Jen Sung

Person

Zhubei City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Highly protective wafer edge sidewall protection layer
- Patent number 12,211,766
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Su-Jen Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with multi-layer etch stop structure
- Patent number 12,198,979
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Cheng Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nitrogen plasma treatment for improving interface between etch stop...
- Patent number 12,159,830
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hui Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure and method for forming the same
- Patent number 12,094,930
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Guan-Yao Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and method of forming same
- Patent number 12,046,557
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Su-Jen Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electro-migration barrier for interconnect
- Patent number 11,923,304
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Su-Jen Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor device with multi-layer etch stop...
- Patent number 11,848,231
- Issue date Dec 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Cheng Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,670,546
- Issue date Jun 6, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Kai Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nitrogen plasma treatment for improving interface between etch stop...
- Patent number 11,532,548
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hui Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electro-migration barrier for interconnect
- Patent number 11,515,255
- Issue date Nov 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Su-Jen Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and method of forming same
- Patent number 11,502,035
- Issue date Nov 15, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Su-Jen Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with multi-layer etch stop structure and metho...
- Patent number 11,282,742
- Issue date Mar 22, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Cheng Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capping layer for improved deposition selectivity
- Patent number 11,264,328
- Issue date Mar 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chao-Chun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electro-migration barrier for Cu interconnect
- Patent number 10,867,920
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Su-Jen Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and method of forming same
- Patent number 10,510,666
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Su-Jen Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capping layer for improved deposition selectivity
- Patent number 10,163,794
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chao-Chun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electro-migration barrier for Cu interconnect
- Patent number 10,163,795
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Su-Jen Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for uniform gas flow in a deposition chamber
- Patent number 9,852,905
- Issue date Dec 26, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Su-Jen Sung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Interconnect structure and method of forming same
- Patent number 9,583,429
- Issue date Feb 28, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Su-Jeng Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacture thereof
- Patent number 9,530,728
- Issue date Dec 27, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Su-Jen Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electro-migration barrier for Cu interconnect
- Patent number 9,490,209
- Issue date Nov 8, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Su-Jen Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capping layer for improved deposition selectivity
- Patent number 9,396,990
- Issue date Jul 19, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chao-Chun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and method of forming the same
- Patent number 9,355,894
- Issue date May 31, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Su-Jen Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacture thereof
- Patent number 9,129,965
- Issue date Sep 8, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Su-Jen Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and method of forming the same
- Patent number 9,041,216
- Issue date May 26, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Su-Jen Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure of porous low-k layer and interconnect structure
- Patent number 8,350,246
- Issue date Jan 8, 2013
- United Microelectronics Corp.
- Mei-Ling Chen
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of fabricating an ultra dielectric constant (K) dielectric l...
- Patent number 8,092,861
- Issue date Jan 10, 2012
- United Microelectronics Corp.
- Mei-Ling Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for manufacturing a dual damascene opening comprising a tren...
- Patent number 8,084,357
- Issue date Dec 27, 2011
- United Microelectronics Corp.
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming method of porous low-k layer and interconnect process
- Patent number 7,947,565
- Issue date May 24, 2011
- United Microelectronics Corp.
- Mei-Ling Chen
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240387630
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Guan-Yao TU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240387252
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Kai Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BONDING INCORPORATING THERMAL CONDUCTIVE PATHS
- Publication number 20240379517
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Su-Jen Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Nitrogen Plasma Treatment For Improving Interface Between Etch Stop...
- Publication number 20240379541
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Hui Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structure and Method of Forming Same
- Publication number 20240332191
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Su-Jen Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH MULTI-LAYER ETCH STOP STRUCTURE
- Publication number 20240079267
- Publication date Mar 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Cheng SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230274975
- Publication date Aug 31, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Kai Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Highly Protective Wafer Edge Sidewall Protection Layer
- Publication number 20230178446
- Publication date Jun 8, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Su-Jen Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Bonding Incorporating Thermal Conductive Paths
- Publication number 20230154837
- Publication date May 18, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Su-Jen Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Nitrogen Plasma Treatment For Improving Interface Between Etch Stop...
- Publication number 20230121958
- Publication date Apr 20, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Hui Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRO-MIGRATION BARRIER FOR INTERCONNECT
- Publication number 20230088795
- Publication date Mar 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Su-Jen Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structure and Method of Forming Same
- Publication number 20220384346
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Su-Jen Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20220336583
- Publication date Oct 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Guan-Yao TU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220285210
- Publication date Sep 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Kai Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR DEVICE WITH MULTI-LAYER ETCH STOP...
- Publication number 20220208603
- Publication date Jun 30, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Cheng SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Nitrogen Plasma Treatment For Improving Interface Between Etch Stop...
- Publication number 20210257293
- Publication date Aug 19, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Hui Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH MULTI-LAYER ETCH STOP STRUCTURE AND METHO...
- Publication number 20210118728
- Publication date Apr 22, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Cheng SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRO-MIGRATION BARRIER FOR INTERCONNECT
- Publication number 20210082831
- Publication date Mar 18, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Su-Jen Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structure and Method of Forming Same
- Publication number 20200111744
- Publication date Apr 9, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Su-Jen Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPPING LAYER FOR IMPROVED DEPOSITION SELECTIVITY
- Publication number 20190148307
- Publication date May 16, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Chao-Chun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRO-MIGRATION BARRIER FOR CU INTERCONNECT
- Publication number 20190148308
- Publication date May 16, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Su-Jen Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structure and Method of Forming Same
- Publication number 20170162506
- Publication date Jun 8, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Su-Jen Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRO-MIGRATION BARRIER FOR CU INTERCONNECT
- Publication number 20170053875
- Publication date Feb 23, 2017
- Taiwan Semiconductor Manufacturing Co., LTD
- Su-Jen Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPPING LAYER FOR IMPROVED DEPOSITION SELECTIVITY
- Publication number 20160254226
- Publication date Sep 1, 2016
- Taiwan Semiconductor Manufacturing Co., LTD
- Chao-Chun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods of Manufacture Thereof
- Publication number 20150380352
- Publication date Dec 31, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Su-Jen Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structure and Method of Forming the Same
- Publication number 20150235894
- Publication date Aug 20, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Su-Jen Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Systems and Methods for Uniform Gas Flow in a Deposition Chamber
- Publication number 20150197846
- Publication date Jul 16, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Su-Jen SUNG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Interconnect Structure and Methods of Forming Same
- Publication number 20150130073
- Publication date May 14, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Su-Jeng Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electro-Migration Barrier for Cu Interconnect
- Publication number 20140264874
- Publication date Sep 18, 2014
- Taiwan Semiconductor Manufacturing Co., LTD
- Su-Jen Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20140264880
- Publication date Sep 18, 2014
- Su-Jen Sung
- H01 - BASIC ELECTRIC ELEMENTS

Su-Jen Sung

Person

Patents Grantslast 30 patents

Highly protective wafer edge sidewall protection layer

Semiconductor device with multi-layer etch stop structure

Nitrogen plasma treatment for improving interface between etch stop...

Integrated circuit structure and method for forming the same

Interconnect structure and method of forming same

Electro-migration barrier for interconnect

Method for forming semiconductor device with multi-layer etch stop...

Semiconductor structure and manufacturing method thereof

Nitrogen plasma treatment for improving interface between etch stop...

Electro-migration barrier for interconnect

Interconnect structure and method of forming same

Semiconductor device with multi-layer etch stop structure and metho...

Capping layer for improved deposition selectivity

Electro-migration barrier for Cu interconnect

Interconnect structure and method of forming same

Capping layer for improved deposition selectivity

Electro-migration barrier for Cu interconnect

Systems and methods for uniform gas flow in a deposition chamber

Interconnect structure and method of forming same

Semiconductor devices and methods of manufacture thereof

Electro-migration barrier for Cu interconnect

Capping layer for improved deposition selectivity

Interconnect structure and method of forming the same

Semiconductor devices and methods of manufacture thereof

Interconnect structure and method of forming the same

Structure of porous low-k layer and interconnect structure

Method of fabricating an ultra dielectric constant (K) dielectric l...

Method for manufacturing a dual damascene opening comprising a tren...

Forming method of porous low-k layer and interconnect process

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

WAFER BONDING INCORPORATING THERMAL CONDUCTIVE PATHS

Nitrogen Plasma Treatment For Improving Interface Between Etch Stop...

Interconnect Structure and Method of Forming Same

SEMICONDUCTOR DEVICE WITH MULTI-LAYER ETCH STOP STRUCTURE

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

Highly Protective Wafer Edge Sidewall Protection Layer

Wafer Bonding Incorporating Thermal Conductive Paths

Nitrogen Plasma Treatment For Improving Interface Between Etch Stop...

ELECTRO-MIGRATION BARRIER FOR INTERCONNECT

Interconnect Structure and Method of Forming Same

INTEGRATED CIRCUIT STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

METHOD FOR FORMING SEMICONDUCTOR DEVICE WITH MULTI-LAYER ETCH STOP...

Nitrogen Plasma Treatment For Improving Interface Between Etch Stop...

SEMICONDUCTOR DEVICE WITH MULTI-LAYER ETCH STOP STRUCTURE AND METHO...

ELECTRO-MIGRATION BARRIER FOR INTERCONNECT

Interconnect Structure and Method of Forming Same

CAPPING LAYER FOR IMPROVED DEPOSITION SELECTIVITY

ELECTRO-MIGRATION BARRIER FOR CU INTERCONNECT

Interconnect Structure and Method of Forming Same

ELECTRO-MIGRATION BARRIER FOR CU INTERCONNECT

CAPPING LAYER FOR IMPROVED DEPOSITION SELECTIVITY

Semiconductor Devices and Methods of Manufacture Thereof

Interconnect Structure and Method of Forming the Same

Systems and Methods for Uniform Gas Flow in a Deposition Chamber

Interconnect Structure and Methods of Forming Same

Electro-Migration Barrier for Cu Interconnect

INTERCONNECT STRUCTURE AND METHOD OF FORMING THE SAME