Su Jeong Suh

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Suwon, KR

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Patents Grantslast 30 patents

Information Patent Grant
Method of fabricating a package substrate
- Patent number 8,951,835
- Issue date Feb 10, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Seung Wook Park
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FABRICATING A PACKAGE SUBSTRATE
- Publication number 20140051212
- Publication date Feb 20, 2014
- Sungkyunkwan University Foundation for Corporate Collaboration
- Seung Wook Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package substrate and fabricating method thereof
- Publication number 20110248408
- Publication date Oct 13, 2011
- Sungkyunkwan University Foundation for Corporate Collaboration
- Seung Wook Park
- H01 - BASIC ELECTRIC ELEMENTS