Su Mi Im

Person

Uiwang-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Dicing die-bonding film and method of forming a cut on the dicing d...
- Patent number 9,287,217
- Issue date Mar 15, 2016
- Cheil Industries, Inc.
- Baek Soung Park
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive composition for a semiconductor device, adhesive film, and...
- Patent number 8,557,896
- Issue date Oct 15, 2013
- Cheil Industries, Inc.
- Chul Jeong
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Bonding film composition for semiconductor assembly, bonding film t...
- Patent number 8,394,493
- Issue date Mar 12, 2013
- Cheil Industries, Inc.
- Yong Woo Hong
- B32 - LAYERED PRODUCTS
Information Patent Grant
Adhesive film composition, associated dicing die bonding film, die...
- Patent number 8,211,540
- Issue date Jul 3, 2012
- Cheil Industries, Inc.
- Yong Woo Hong
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive film composition, associated dicing die bonding film, and...
- Patent number 7,863,758
- Issue date Jan 4, 2011
- Cheil Industries, Inc.
- Ki Sung Jung
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR PACKAGE AND...
- Publication number 20160137808
- Publication date May 19, 2016
- Samsung SDI Co., Ltd.
- Tae Shin EOM
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
DICING DIE-BONDING FILM AND METHOD OF FORMING A CUT ON THE DICING D...
- Publication number 20140306357
- Publication date Oct 16, 2014
- Baek Soung PARK
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE COMPOSITION FOR A SEMICONDUCTOR DEVICE, ADHESIVE FILM, AND...
- Publication number 20110160339
- Publication date Jun 30, 2011
- Chul JEONG
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ATTACH FILM COMPOSITION FOR SEMICONDUCTOR ASSEMBLY AND ATTACH FILM...
- Publication number 20110159294
- Publication date Jun 30, 2011
- Gyu Seok Song
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Adhesive film composition for semiconductor assembly, adhesive film...
- Publication number 20090162650
- Publication date Jun 25, 2009
- Yong Woo Hong
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Adhesive film composition, associated dicing die bonding film, die...
- Publication number 20090110940
- Publication date Apr 30, 2009
- Yong Woo Hong
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Adhesive film composition, associated dicing die bonding film, and...
- Publication number 20080145668
- Publication date Jun 19, 2008
- Ki Sung Jung
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Bonding film composition for semiconductor assembly, bonding film t...
- Publication number 20080102284
- Publication date May 1, 2008
- Yong Woo Hong
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Person

Patents Grantslast 30 patents

Dicing die-bonding film and method of forming a cut on the dicing d...

Adhesive composition for a semiconductor device, adhesive film, and...

Bonding film composition for semiconductor assembly, bonding film t...

Adhesive film composition, associated dicing die bonding film, die...

Adhesive film composition, associated dicing die bonding film, and...

Patents Applicationslast 30 patents

EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR PACKAGE AND...

DICING DIE-BONDING FILM AND METHOD OF FORMING A CUT ON THE DICING D...

ADHESIVE COMPOSITION FOR A SEMICONDUCTOR DEVICE, ADHESIVE FILM, AND...

ATTACH FILM COMPOSITION FOR SEMICONDUCTOR ASSEMBLY AND ATTACH FILM...

Adhesive film composition for semiconductor assembly, adhesive film...

Adhesive film composition, associated dicing die bonding film, die...

Adhesive film composition, associated dicing die bonding film, and...

Bonding film composition for semiconductor assembly, bonding film t...