Su-Yu Yeh

Person

Taipei, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Wafer treatment system and method of treating wafer
- Patent number 12,183,550
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Po Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
BSI chip with backside alignment mark
- Patent number 12,094,997
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih Wei Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polysilicon removal in word line contact region of memory devices
- Patent number 12,041,771
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yen-Jou Wu
- G11 - INFORMATION STORAGE
Information Patent Grant
Manufacturing method of semiconductor device and semiconductor proc...
- Patent number 11,899,368
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Kai Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device and manufacturing method thereof
- Patent number 11,804,529
- Issue date Oct 31, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Chu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor grid and method of manufacturing same
- Patent number 11,652,133
- Issue date May 16, 2023
- Taiwan Semiconductor Manufacturing Co.
- H. L. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor grid and method of fabrication of same
- Patent number 11,532,658
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chin-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polysilicon removal in word line contact region of memory devices
- Patent number 11,527,543
- Issue date Dec 13, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yen-Jou Wu
- G11 - INFORMATION STORAGE
Information Patent Grant
Manufacturing method of semiconductor device and semiconductor proc...
- Patent number 11,454,891
- Issue date Sep 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Kai Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
BSI chip with backside alignment mark
- Patent number 11,430,909
- Issue date Aug 30, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih Wei Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of monitoring eye strain and related optical system
- Patent number 11,317,800
- Issue date May 3, 2022
- Ganzin Technology, Inc.
- Kuei-An Li
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Memory device and manufacturing method thereof
- Patent number 11,282,931
- Issue date Mar 22, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Chu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor with pad structure
- Patent number 11,164,903
- Issue date Nov 2, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Huai-jen Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor grid and method of manufacturing same
- Patent number 11,069,740
- Issue date Jul 20, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- H. L. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device and semiconductor proc...
- Patent number 11,061,333
- Issue date Jul 13, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Kai Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical replacement system
- Patent number 11,029,603
- Issue date Jun 8, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu Kai Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for monitoring gas in wafer processing system
- Patent number 11,004,709
- Issue date May 11, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Chieh Hsieh
- G01 - MEASURING TESTING
Information Patent Grant
Photoresist bottle container
- Patent number 10,943,802
- Issue date Mar 9, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu Kai Chen
- F17 - STORING OF DISTRIBUTING GASES OR LIQUIDS
Information Patent Grant
Method for forming a semiconductor device
- Patent number 10,879,289
- Issue date Dec 29, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chin-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding wafers and bonding tool
- Patent number 10,872,873
- Issue date Dec 22, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lens structure
- Patent number 10,050,159
- Issue date Aug 14, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien-Chih Chen
- G02 - OPTICS
Information Patent Grant
Method and system of enhancing a backlight-scaled image
- Patent number 9,367,905
- Issue date Jun 14, 2016
- NATIONAL TAIWAN UNIVERSITY
- Tai-Hsiang Huang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Multi-media data rate allocation method and voice over IP data rate...
- Patent number 9,253,116
- Issue date Feb 2, 2016
- NATIONAL TAIWAN UNIVERSITY
- Polly Huang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Learning-based visual attention prediction system and method thereof
- Patent number 8,636,361
- Issue date Jan 28, 2014
- NATIONAL TAIWAN UNIVERSITY
- Homer H. Chen
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Object-based system and method of directing visual attention by a s...
- Patent number 8,432,491
- Issue date Apr 30, 2013
- NATIONAL TAIWAN UNIVERSITY
- Homer H. Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method of directing a viewer's attention subliminally in image display
- Patent number 8,094,163
- Issue date Jan 10, 2012
- Himax Technologies Limited
- Homer H. Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method of high selectivity wet etching of salicides
- Patent number 6,875,705
- Issue date Apr 5, 2005
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chao-Jie Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer chuck for producing an inert gas blanket and method for using
- Patent number 6,702,900
- Issue date Mar 9, 2004
- Taiwan Semiconductor Manufacturing Co., Ltd
- Su-Yu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method reducing the effects of N2 gas contamination in an ion impla...
- Patent number 6,605,812
- Issue date Aug 12, 2003
- Taiwan Semiconductor Manufacturing Co., Ltd
- Su-Yu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for eliminating wafer breakage during wafer tr...
- Patent number 6,530,103
- Issue date Mar 11, 2003
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jeng-Yang Pan
- B08 - CLEANING

Patents Applicationslast 30 patents

Information Patent Application
BARRIER LAYERS IN SEMICONDUCTOR DEVICES
- Publication number 20250031399
- Publication date Jan 23, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mu-Min Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cut Metal Gate Refill With Buffer Layer
- Publication number 20250014946
- Publication date Jan 9, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Fan Hsuan Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR CLEANING A PRE-CLEAN PROCESS CHAMBER
- Publication number 20240384402
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Ting Tsai
- B08 - CLEANING
Information Patent Application
WAFER TREATMENT SYSTEM AND METHOD OF TREATING WAFER
- Publication number 20240387146
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Po Hsun CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BSI CHIP WITH BACKSIDE ALIGNMENT MARK
- Publication number 20240363791
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih Wei Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CRYOGENIC PUMP FOR SEMICONDUCTOR PROCESSING
- Publication number 20240337265
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu Min CHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR GRID AND METHOD OF FABRICATION OF SAME
- Publication number 20240047496
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chin-Yu LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Polysilicon Removal In Word Line Contact Region Of Memory Devices
- Publication number 20230389309
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yen-Jou WU
- G11 - INFORMATION STORAGE
Information Patent Application
MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230369430
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chu LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR GRID AND METHOD OF FABRICATION OF SAME
- Publication number 20230120006
- Publication date Apr 20, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chin-Yu LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20230013102
- Publication date Jan 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Chih WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR CLEANING A PRE-CLEAN PROCESS CHAMBER
- Publication number 20230017955
- Publication date Jan 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Ting Tsai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PROC...
- Publication number 20220382161
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Kai Chen
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
POLYSILICON REMOVAL IN WORD LINE CONTACT REGION OF MEMORY DEVICES
- Publication number 20220367495
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yen-Jou WU
- G11 - INFORMATION STORAGE
Information Patent Application
BSI Chip with Backside Alignment Mark
- Publication number 20220359781
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih Wei Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR GRID AND METHOD OF FABRICATION OF SAME
- Publication number 20220359598
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chin-Yu LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR TREATING SEMICONDUCTOR WAFER
- Publication number 20220351948
- Publication date Nov 3, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- HUNG-BIN LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER TREATMENT SYSTEM AND METHOD OF TREATING WAFER
- Publication number 20220277933
- Publication date Sep 1, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Po Hsun CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20220216315
- Publication date Jul 7, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chu LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYSILICON REMOVAL IN WORD LINE CONTACT REGION OF MEMORY DEVICES
- Publication number 20210408023
- Publication date Dec 30, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Y.J. WU
- G11 - INFORMATION STORAGE
Information Patent Application
IMAGE SENSOR GRID AND METHOD OF MANUFACTURING SAME
- Publication number 20210351225
- Publication date Nov 11, 2021
- Taiwan Semiconductor Manufacturing Co.
- H. L. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PROC...
- Publication number 20210341843
- Publication date Nov 4, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Kai Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR ETCHING
- Publication number 20210249232
- Publication date Aug 12, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- HUNG-BIN LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image sensor grid and method of fabrication of same
- Publication number 20210225918
- Publication date Jul 22, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chin-Yu LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BSI Chip with Backside Alignment Mark
- Publication number 20210036179
- Publication date Feb 4, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih Wei Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20210036118
- Publication date Feb 4, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chu LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A SEMICONDUCTOR DEVICE
- Publication number 20210020669
- Publication date Jan 21, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chin-Yu LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR WITH PAD STRUCTURE
- Publication number 20200373344
- Publication date Nov 26, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Huai-jen TUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR GRID AND METHOD OF MANUFACTURING SAME
- Publication number 20200279887
- Publication date Sep 3, 2020
- Taiwan Semiconductor Manufacturing Co.
- H. L. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MONITORING EYE STRAIN AND RELATED OPTICAL SYSTEM
- Publication number 20200205657
- Publication date Jul 2, 2020
- Ganzin Technology, Inc.
- Kuei-An Li
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE

Person

Patents Grantslast 30 patents

Wafer treatment system and method of treating wafer

BSI chip with backside alignment mark

Polysilicon removal in word line contact region of memory devices

Manufacturing method of semiconductor device and semiconductor proc...

Memory device and manufacturing method thereof

Image sensor grid and method of manufacturing same

Image sensor grid and method of fabrication of same

Polysilicon removal in word line contact region of memory devices

Manufacturing method of semiconductor device and semiconductor proc...

BSI chip with backside alignment mark

Method of monitoring eye strain and related optical system

Memory device and manufacturing method thereof

Image sensor with pad structure

Image sensor grid and method of manufacturing same

Manufacturing method of semiconductor device and semiconductor proc...

Chemical replacement system

Method for monitoring gas in wafer processing system

Photoresist bottle container

Method for forming a semiconductor device

Method for bonding wafers and bonding tool

Lens structure

Method and system of enhancing a backlight-scaled image

Multi-media data rate allocation method and voice over IP data rate...

Learning-based visual attention prediction system and method thereof

Object-based system and method of directing visual attention by a s...

Method of directing a viewer's attention subliminally in image display

Method of high selectivity wet etching of salicides

Wafer chuck for producing an inert gas blanket and method for using

Method reducing the effects of N2 gas contamination in an ion impla...

Method and apparatus for eliminating wafer breakage during wafer tr...

Patents Applicationslast 30 patents

BARRIER LAYERS IN SEMICONDUCTOR DEVICES

Cut Metal Gate Refill With Buffer Layer

SYSTEM AND METHOD FOR CLEANING A PRE-CLEAN PROCESS CHAMBER

WAFER TREATMENT SYSTEM AND METHOD OF TREATING WAFER

BSI CHIP WITH BACKSIDE ALIGNMENT MARK

CRYOGENIC PUMP FOR SEMICONDUCTOR PROCESSING

IMAGE SENSOR GRID AND METHOD OF FABRICATION OF SAME

Polysilicon Removal In Word Line Contact Region Of Memory Devices

MEMORY DEVICE AND MANUFACTURING METHOD THEREOF

IMAGE SENSOR GRID AND METHOD OF FABRICATION OF SAME

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

SYSTEM AND METHOD FOR CLEANING A PRE-CLEAN PROCESS CHAMBER

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PROC...

POLYSILICON REMOVAL IN WORD LINE CONTACT REGION OF MEMORY DEVICES

BSI Chip with Backside Alignment Mark

IMAGE SENSOR GRID AND METHOD OF FABRICATION OF SAME

METHOD FOR TREATING SEMICONDUCTOR WAFER

WAFER TREATMENT SYSTEM AND METHOD OF TREATING WAFER

MEMORY DEVICE AND MANUFACTURING METHOD THEREOF

POLYSILICON REMOVAL IN WORD LINE CONTACT REGION OF MEMORY DEVICES

IMAGE SENSOR GRID AND METHOD OF MANUFACTURING SAME

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PROC...

APPARATUS AND METHOD FOR ETCHING

Image sensor grid and method of fabrication of same

BSI Chip with Backside Alignment Mark

MEMORY DEVICE AND MANUFACTURING METHOD THEREOF

METHOD FOR FORMING A SEMICONDUCTOR DEVICE

IMAGE SENSOR WITH PAD STRUCTURE

IMAGE SENSOR GRID AND METHOD OF MANUFACTURING SAME

METHOD OF MONITORING EYE STRAIN AND RELATED OPTICAL SYSTEM