Subahu Desai

Person

Vestal, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Human being tracking and monitoring system
- Patent number 9,007,202
- Issue date Apr 14, 2015
- Benson Chan
- G08 - SIGNALLING
Information Patent Grant
Method for making a multilayered circuitized substrate
- Patent number 7,627,947
- Issue date Dec 8, 2009
- Endicott Interconnect Technologies, Inc.
- Thomas J. Davis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of improving electrical connections in circuitized substrates
- Patent number 7,629,559
- Issue date Dec 8, 2009
- Endicott Interconnect Technologies, Inc.
- Subahu D. Desai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making circuitized substrate with internal organic memory...
- Patent number 7,326,643
- Issue date Feb 5, 2008
- Endicott Interconnect Technologies, Inc.
- Subahu D. Desai
- G11 - INFORMATION STORAGE
Information Patent Grant
Circuitized substrate with internal organic memory device, electric...
- Patent number 7,253,502
- Issue date Aug 7, 2007
- Endicott Interconnect Technologies, Inc.
- Subahu D. Desai
- G11 - INFORMATION STORAGE
Information Patent Grant
Printed wiring board
- Patent number 6,740,819
- Issue date May 25, 2004
- International Business Machines Corporation
- Anilkumar C. Bhatt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for making a printed wiring board
- Patent number 6,608,757
- Issue date Aug 19, 2003
- International Business Machines Corporation
- Anilkumar C. Bhatt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of surface finishes for eliminating surface irregularities a...
- Patent number 6,093,335
- Issue date Jul 25, 2000
- International Business Machines Corporation
- Ashwinkumar C. Bhatt
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Chip carrier having a chip mounted on an organic dielectric substra...
- Patent number 6,038,137
- Issue date Mar 14, 2000
- International Business Machines Corporation
- Ashwinkumar Chinuprasad Bhatt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single-tiered organic chip carriers for wire bond-type chips
- Patent number 5,798,909
- Issue date Aug 25, 1998
- International Business Machines Corporation
- Ashwinkumar Chinuprasad Bhatt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip carrier having an organic photopatternable material and a meta...
- Patent number 5,724,232
- Issue date Mar 3, 1998
- International Business Machines Corporation
- Ashwinkumar Chinuprasad Bhatt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for the cross-sectional design of multi-layer...
- Patent number 5,546,321
- Issue date Aug 13, 1996
- International Business Machines Corporation
- Chi S. Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and apparatus for the cross-sectional design of multi-layer...
- Patent number 5,519,633
- Issue date May 21, 1996
- International Business Machines Corporation
- Chi S. Chang
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
Method of making circuitized substrate with internal organic memory...
- Publication number 20070249089
- Publication date Oct 25, 2007
- Endicott Interconnect Technologies, Inc.
- Subahu D. Desai
- G11 - INFORMATION STORAGE
Information Patent Application
Method for making a multilayered circuitized substrate
- Publication number 20070199195
- Publication date Aug 30, 2007
- Endicott Interconnect Technologies, Inc.
- Thomas J. Davis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of improving electrical connections in circuitized substrates
- Publication number 20070139977
- Publication date Jun 21, 2007
- Endicott Interconnect Technologies, Inc.
- Subahu D. Desai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuitized substrate with internal organic memory device, method o...
- Publication number 20060022303
- Publication date Feb 2, 2006
- Endicott Interconnect Technologies, Inc.
- Subahu D. Desai
- G11 - INFORMATION STORAGE
Information Patent Application
Printed wiring board
- Publication number 20030188890
- Publication date Oct 9, 2003
- IBM Corporation
- Anilkumar C. Bhatt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Subahu Desai

Person

Patents Grantslast 30 patents

Human being tracking and monitoring system

Method for making a multilayered circuitized substrate

Method of improving electrical connections in circuitized substrates

Method of making circuitized substrate with internal organic memory...

Circuitized substrate with internal organic memory device, electric...

Printed wiring board

Method for making a printed wiring board

Method of surface finishes for eliminating surface irregularities a...

Chip carrier having a chip mounted on an organic dielectric substra...

Single-tiered organic chip carriers for wire bond-type chips

Chip carrier having an organic photopatternable material and a meta...

Method and apparatus for the cross-sectional design of multi-layer...

Method and apparatus for the cross-sectional design of multi-layer...

Patents Applicationslast 30 patents

Method of making circuitized substrate with internal organic memory...

Method for making a multilayered circuitized substrate

Method of improving electrical connections in circuitized substrates

Circuitized substrate with internal organic memory device, method o...

Printed wiring board