Subaramaniym Senivasan

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Melaka, MY

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package with blind hole attachment to heat sink
- Patent number 12,191,229
- Issue date Jan 7, 2025
- Infineon Technologies AG
- Ryan Tordillo Comadre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device with dual heat dissipation structures
- Patent number 11,908,771
- Issue date Feb 20, 2024
- Infineon Technologies AG
- Jayaganasan Narayanasamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adjustable pick-up head and method for manufacturing a device
- Patent number 9,196,521
- Issue date Nov 24, 2015
- Infineon Technologies AG
- Abdul Rahman Mohamed
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
DUAL FUNCTIONAL THERMAL PERFORMANCE SEMICONDUCTOR PACKAGE AND RELAT...
- Publication number 20230154827
- Publication date May 18, 2023
- INFINEON TECHNOLOGIES AG
- Jayaganasan Narayanasamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Blind Hole Attachment to Heat Sink
- Publication number 20230125452
- Publication date Apr 27, 2023
- INFINEON TECHNOLOGIES AG
- Ryan Tordillo Comadre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adjustable Pick-up Head and Method for Manufacturing a Device
- Publication number 20140123454
- Publication date May 8, 2014
- INFINEON TECHNOLOGIES AG
- Abdul Rahman Mohamed
- H01 - BASIC ELECTRIC ELEMENTS