Subhash Rewachand Nariani

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Pleasanton, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Wafer-level chip scale package
- Patent number 8,710,664
- Issue date Apr 29, 2014
- Volterra Semiconductor Corporation
- Efren M. Lacap
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer-level chip scale package
- Patent number 8,106,516
- Issue date Jan 31, 2012
- Volterra Semiconductor Corporation
- Efren M. Lacap
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Wafer-Level Chip Scale Package
- Publication number 20130026638
- Publication date Jan 31, 2013
- Efren M. Lacap
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wafer-level chip scale package
- Publication number 20050045697
- Publication date Mar 3, 2005
- Efren M. Lacap
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR