Subramanian Balakumar

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Method of fabricating tensile strained layers and compressive strai...
- Patent number 7,439,165
- Issue date Oct 21, 2008
- Agency for Sceince, Technology and Reasearch
- Patrick Guo Oiang Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High K artificial lattices for capacitor applications to use in Cu...
- Patent number 7,095,073
- Issue date Aug 22, 2006
- Chartered Semiconductor Manufacturing Ltd.
- Subramanian Balakumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High K artificial lattices for capacitor applications to use in CU...
- Patent number 6,830,971
- Issue date Dec 14, 2004
- Chartered Semiconductor Manufacturing Ltd.
- Subramanian Balakumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Linear polishing for improving substrate uniformity
- Patent number 6,726,545
- Issue date Apr 27, 2004
- Chartered Semiconductor Manufacturing Ltd.
- Subramanian Balakumar
- B24 - GRINDING POLISHING
Information Patent Grant
Multiple step CMP polishing
- Patent number 6,663,472
- Issue date Dec 16, 2003
- Chartered Semiconductor Manufacturing Ltd.
- Victor Seng-Keong Lim
- B24 - GRINDING POLISHING
Information Patent Grant
Method to form shallow trench isolations
- Patent number 6,649,486
- Issue date Nov 18, 2003
- Chartered Semiconductor Manufacturing Ltd.
- Subramanian Balakumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for improving oxide erosion of tungsten CMP operations
- Patent number 6,569,770
- Issue date May 27, 2003
- Chartered Semiconductor Manufacturing Ltd.
- Xian Bin Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMP uniformity
- Patent number 6,248,006
- Issue date Jun 19, 2001
- Chartered Semiconductor Manufacturing Ltd.
- Madhusudan Mukhopadhyay
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
Method of fabricating strained channel devices
- Publication number 20060226483
- Publication date Oct 12, 2006
- Agency For Science, Technology and Research
- Patrick Guo Oiang Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High K artificial lattices for capacitor applications to use in Cu...
- Publication number 20050118780
- Publication date Jun 2, 2005
- Chartered Semiconductor Manufacturing Ltd.
- Subramanian Balakumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High K artificial lattices for capacitor applications to use in CU...
- Publication number 20040087101
- Publication date May 6, 2004
- Chartered Semiconductor Manufacturing Ltd.
- Subramanian Balakumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Linear polishing for improving substrate uniformity
- Publication number 20030203710
- Publication date Oct 30, 2003
- Chartered Semiconductor Manufacturing Ltd.
- Subramanian Balakumar
- B24 - GRINDING POLISHING
Information Patent Application
Multiple step CMP polishing
- Publication number 20030148712
- Publication date Aug 7, 2003
- Chartered Semiconductor Manufacturing Ltd.
- Victor Seng-Keong Lim
- B24 - GRINDING POLISHING
Information Patent Application
New method for improving oxide erosion of tungsten CMP operations
- Publication number 20030003745
- Publication date Jan 2, 2003
- Chartered Semiconductor Manufacturing Ltd.
- Xian Bin Wang
- H01 - BASIC ELECTRIC ELEMENTS

Subramanian Balakumar

Person

Patents Grantslast 30 patents

Method of fabricating tensile strained layers and compressive strai...

High K artificial lattices for capacitor applications to use in Cu...

High K artificial lattices for capacitor applications to use in CU...

Linear polishing for improving substrate uniformity

Multiple step CMP polishing

Method to form shallow trench isolations

Method for improving oxide erosion of tungsten CMP operations

CMP uniformity

Patents Applicationslast 30 patents

Method of fabricating strained channel devices

High K artificial lattices for capacitor applications to use in Cu...

High K artificial lattices for capacitor applications to use in CU...

Linear polishing for improving substrate uniformity

Multiple step CMP polishing

New method for improving oxide erosion of tungsten CMP operations