Suchet P. Chai

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San Jose, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Method of packaging a device with a lead frame, and an apparatus fo...
- Patent number 6,828,663
- Issue date Dec 7, 2004
- Teledyne Technologies Incorporated
- Tong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microwave device and method for making same
- Patent number 6,507,110
- Issue date Jan 14, 2003
- Teledyne Technologies Incorporated
- Tong Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method of forming a package
- Publication number 20050023663
- Publication date Feb 3, 2005
- Tong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of packaging a device with a lead frame, and an apparatus fo...
- Publication number 20020125553
- Publication date Sep 12, 2002
- Tong Chen
- H01 - BASIC ELECTRIC ELEMENTS