Sudharshan Sugavanesh Udhayakumar

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Santa Clara, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Temperature control element utilized in device die packages
- Patent number 11,955,406
- Issue date Apr 9, 2024
- Google LLC
- Yingying Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Methods and Structures for Coupling Thermal Dissipating Elements an...
- Publication number 20240121931
- Publication date Apr 11, 2024
- Google LLC
- Yingshi Tang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Compliant Pad Spacer for Three-Dimensional Integrated Circuit Package
- Publication number 20240055317
- Publication date Feb 15, 2024
- Google LLC
- Emad Samadiani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pin Fin Placement Assembly for Forming Temperature Control Element...
- Publication number 20240038620
- Publication date Feb 1, 2024
- Google LLC
- Yingshi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Temperature Control Element Utilized in Device Die Packages
- Publication number 20230163048
- Publication date May 25, 2023
- Google LLC
- Yingying Wang
- H01 - BASIC ELECTRIC ELEMENTS