Sudipto Ranendra Roy

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Method of copper/copper surface bonding using a conducting polymer...
- Patent number 7,452,808
- Issue date Nov 18, 2008
- Chartered Semiconductor Manufacturing Ltd.
- Simon Chooi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of copper/copper surface bonding using a conducting polymer...
- Patent number 7,060,613
- Issue date Jun 13, 2006
- Chartered Semiconductor Manufacturing Ltd.
- Simon Chooi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper diffusion deterrent interface
- Patent number 6,987,321
- Issue date Jan 17, 2006
- Chartered Semiconductor Manufacturing Ltd.
- Simon Chooi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of copper/copper surface bonding using a conducting polymer...
- Patent number 6,967,162
- Issue date Nov 22, 2005
- Chartered Semiconductor Manufacturing Ltd.
- Simon Chooi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of copper/copper surface bonding using a conducting polymer...
- Patent number 6,821,888
- Issue date Nov 23, 2004
- Chartered Semiconductor Manufacturing Ltd.
- Yakub Aliyu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods to clean copper contamination on wafer edge
- Patent number 6,813,796
- Issue date Nov 9, 2004
- Chartered Semiconductor
- Sudipto Ranendra Roy
- B08 - CLEANING
Information Patent Grant
Method of using hydrogen plasma to pre-clean copper surfaces during...
- Patent number 6,720,204
- Issue date Apr 13, 2004
- Chartered Semiconductor Manufacturing Ltd.
- John Leonard Sudijono
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of application of conductive cap-layer in flip-chip, cob, an...
- Patent number 6,705,512
- Issue date Mar 16, 2004
- Chartered Semiconductor Manufacturing Ltd.
- Kwok Keung Paul Ho
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for cleaning semiconductor structures using hydrocarbon and...
- Patent number 6,692,579
- Issue date Feb 17, 2004
- Chartered Semiconductor Manufacturing Ltd.
- Sudipto Ranendra Roy
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Method to create a copper diffusion deterrent interface
- Patent number 6,683,002
- Issue date Jan 27, 2004
- Chartered Semiconductor Manufacturing Ltd.
- Simon Chooi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded metal scheme for liquid crystal display (LCD) application
- Patent number 6,670,209
- Issue date Dec 30, 2003
- Chartered Semiconductor Manufacturing Ltd.
- Sudipto Ranendra Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-siphoning CMP tool design for applications such as copper CMP...
- Patent number 6,572,731
- Issue date Jun 3, 2003
- Chartered Semiconductor Manufacturing Ltd.
- Sudipto R. Roy
- B24 - GRINDING POLISHING
Information Patent Grant
Linear CMP tool design using in-situ slurry distribution and concur...
- Patent number 6,547,652
- Issue date Apr 15, 2003
- Chartered Semiconductor Manufacturing Ltd.
- Sudipto Ranendra Roy
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus for removing contaminants from the perimeter o...
- Patent number 6,540,841
- Issue date Apr 1, 2003
- Chartered Semiconductor Manufacturing Ltd.
- Sudipto Ranendra Roy
- B08 - CLEANING
Information Patent Grant
Linear CMP tool design with closed loop slurry distribution
- Patent number 6,521,079
- Issue date Feb 18, 2003
- Chartered Semiconductor Manufacturing Ltd.
- Sudipto Ranendra Roy
- B24 - GRINDING POLISHING
Information Patent Grant
Method of manufacturing embedded organic stop layer for dual damasc...
- Patent number 6,475,810
- Issue date Nov 5, 2002
- Chartered Semiconductor Manufacturing Ltd.
- Mei Sheng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to create copper traps by modifying treatment on the dielect...
- Patent number 6,429,117
- Issue date Aug 6, 2002
- Chartered Semiconductor Manufacturing Ltd.
- John Sudijono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of application of displacement reaction to form a conductive...
- Patent number 6,417,088
- Issue date Jul 9, 2002
- Chartered Semiconductor Manufacturing Ltd.
- Kwok Keung Paul Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of application of copper solution in flip-chip, COB, and mic...
- Patent number 6,415,973
- Issue date Jul 9, 2002
- Chartered Semiconductor Manufacturing Ltd.
- Kwok Keung Paul Ho
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method to thin down copper barriers in deep submicron geometries by...
- Patent number 6,391,783
- Issue date May 21, 2002
- Chartered Semiconductor Manufacturing Ltd.
- John Sudijono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of application of conductive cap-layer in flip-chip, COB, an...
- Patent number 6,378,759
- Issue date Apr 30, 2002
- Chartered Semiconductor Manufacturing Ltd.
- Kwok Keung Paul Ho
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process without post-etch cleaning-converting polymer and by-produc...
- Patent number 6,365,508
- Issue date Apr 2, 2002
- Chartered Semiconductor Manufacturing Ltd.
- Mei Sheng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of copper transport prevention by a sputtered gettering laye...
- Patent number 6,358,821
- Issue date Mar 19, 2002
- Chartered Semiconductor Manufacturing Inc.
- Subhash Gupta
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method to remove copper contamination by using downstream oxygen an...
- Patent number 6,350,689
- Issue date Feb 26, 2002
- Chartered Semiconductor Manufacturing Ltd.
- Paul Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating copper metal bumps for flip-chip or chip-on-b...
- Patent number 6,340,608
- Issue date Jan 22, 2002
- Chartered Semiconductor Manufacturing Ltd.
- Simon Chooi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for minimizing copper diffusion by doping an inorganic diele...
- Patent number 6,309,982
- Issue date Oct 30, 2001
- Chartered Semiconductor Manufacturing Ltd.
- Simon Chooi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Application of vapor phase HFACAC-based compound for use in copper...
- Patent number 6,261,955
- Issue date Jul 17, 2001
- Chartered Semiconductor Manufacturing Ltd.
- Yakub Aliyu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Linear CMP tool design using in-situ slurry distribution and concur...
- Patent number 6,235,635
- Issue date May 22, 2001
- Chartered Semiconductor Manufacturing Ltd.
- Sudipto Ranendra Roy
- B24 - GRINDING POLISHING
Information Patent Grant
Linear CMP tool design with closed loop slurry distribution
- Patent number 6,156,659
- Issue date Dec 5, 2000
- Chartered Semiconductor Manufacturing Ltd.
- Sudipto Ranendra Roy
- B24 - GRINDING POLISHING
Information Patent Grant
Copper interconnect patterning
- Patent number 6,150,269
- Issue date Nov 21, 2000
- Chartered Semiconductor Manufacturing Company, Ltd.
- Sudipto Ranendra Roy
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method of copper/copper surface bonding using a conducting polymer...
- Publication number 20050090102
- Publication date Apr 28, 2005
- Simon Chooi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of copper/copper surface bonding using a conducting polymer...
- Publication number 20050090037
- Publication date Apr 28, 2005
- Chartered Semiconductor Manufacturing Ltd.
- Yakub Aliyu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of copper/copper surface bonding using a conducting polymer...
- Publication number 20050090039
- Publication date Apr 28, 2005
- Chartered Semiconductor Manufacturing Ltd.
- Simon Chooi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method to create a copper diffusion deterrent interface
- Publication number 20040227247
- Publication date Nov 18, 2004
- CHARTERED SEMICONDUCTOR MANFACTURING LTD.
- Simon Chooi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of using hydrogen plasma to pre-clean copper surfaces during...
- Publication number 20030192943
- Publication date Oct 16, 2003
- Chartered Semiconductor Manufacturing Ltd.
- John Leonard Sudijono
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Apparatus and methods to clean copper contamination on wafer edge
- Publication number 20030140943
- Publication date Jul 31, 2003
- Chartered Semiconductor Manufacturing Ltd.
- Sudipto Ranendra Roy
- B08 - CLEANING
Information Patent Application
Method of copper/copper surface bonding using a conducting polymer...
- Publication number 20030032275
- Publication date Feb 13, 2003
- Yakub Aliyu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of application of conductive cap-layer in flip-chip, cob, an...
- Publication number 20020100794
- Publication date Aug 1, 2002
- Chartered Semiconductor Manufacturing Ltd.
- Kwok Keung Paul Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for cleaning semiconductor structures using hydrocarbon and...
- Publication number 20020096190
- Publication date Jul 25, 2002
- Chartered Semiconductor Manufacturing Inc.
- Sudipto Ranendra Roy
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Application
Application of vapor phase HFACAC-based compound for use in copper...
- Publication number 20020048950
- Publication date Apr 25, 2002
- Chartered Semiconductor Manufacturing Ltd.
- Yakub Aliyu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Sudipto Ranendra Roy

Person

Patents Grantslast 30 patents

Method of copper/copper surface bonding using a conducting polymer...

Method of copper/copper surface bonding using a conducting polymer...

Copper diffusion deterrent interface

Method of copper/copper surface bonding using a conducting polymer...

Method of copper/copper surface bonding using a conducting polymer...

Apparatus and methods to clean copper contamination on wafer edge

Method of using hydrogen plasma to pre-clean copper surfaces during...

Method of application of conductive cap-layer in flip-chip, cob, an...

Method for cleaning semiconductor structures using hydrocarbon and...

Method to create a copper diffusion deterrent interface

Embedded metal scheme for liquid crystal display (LCD) application

Self-siphoning CMP tool design for applications such as copper CMP...

Linear CMP tool design using in-situ slurry distribution and concur...

Method and apparatus for removing contaminants from the perimeter o...

Linear CMP tool design with closed loop slurry distribution

Method of manufacturing embedded organic stop layer for dual damasc...

Method to create copper traps by modifying treatment on the dielect...

Method of application of displacement reaction to form a conductive...

Method of application of copper solution in flip-chip, COB, and mic...

Method to thin down copper barriers in deep submicron geometries by...

Method of application of conductive cap-layer in flip-chip, COB, an...

Process without post-etch cleaning-converting polymer and by-produc...

Method of copper transport prevention by a sputtered gettering laye...

Method to remove copper contamination by using downstream oxygen an...

Method of fabricating copper metal bumps for flip-chip or chip-on-b...

Method for minimizing copper diffusion by doping an inorganic diele...

Application of vapor phase HFACAC-based compound for use in copper...

Linear CMP tool design using in-situ slurry distribution and concur...

Linear CMP tool design with closed loop slurry distribution

Copper interconnect patterning

Patents Applicationslast 30 patents

Method of copper/copper surface bonding using a conducting polymer...

Method of copper/copper surface bonding using a conducting polymer...

Method of copper/copper surface bonding using a conducting polymer...

Method to create a copper diffusion deterrent interface

Method of using hydrogen plasma to pre-clean copper surfaces during...

Apparatus and methods to clean copper contamination on wafer edge

Method of copper/copper surface bonding using a conducting polymer...

Method of application of conductive cap-layer in flip-chip, cob, an...

Method for cleaning semiconductor structures using hydrocarbon and...

Application of vapor phase HFACAC-based compound for use in copper...