Sue Teng

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Belmont, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Cooling heatshield for clamshell BGA rework
- Patent number 12,243,804
- Issue date Mar 4, 2025
- Google LLC
- Sue Yun Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compression-loaded printed circuit assembly for solder defect mitig...
- Patent number 11,791,231
- Issue date Oct 17, 2023
- Google LLC
- Sue Yun Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling heatshield for clamshell BGA rework
- Patent number 11,791,239
- Issue date Oct 17, 2023
- Google LLC
- Sue Yun Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compression-loaded printed circuit assembly for solder defect mitig...
- Patent number 11,756,851
- Issue date Sep 12, 2023
- Google LLC
- Sue Yun Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compression-loaded printed circuit assembly for solder defect mitig...
- Patent number 11,183,438
- Issue date Nov 23, 2021
- Google LLC
- Sue Yun Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for strain monitoring of printed circuit board...
- Patent number 7,621,190
- Issue date Nov 24, 2009
- Cisco Technology, Inc.
- Mudasir Ahmad
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
Compliant Pad Spacer for Three-Dimensional Integrated Circuit Package
- Publication number 20240055317
- Publication date Feb 15, 2024
- Google LLC
- Emad Samadiani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cooling Heatshield for Clamshell BGA Rework
- Publication number 20220301977
- Publication date Sep 22, 2022
- Google LLC
- Sue Yun Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Compression-Loaded Printed Circuit Assembly For Solder Defect Mitig...
- Publication number 20220077020
- Publication date Mar 10, 2022
- Google LLC
- Sue Yun Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Compression-Loaded Printed Circuit Assembly For Solder Defect Mitig...
- Publication number 20210359448
- Publication date Nov 18, 2021
- Google LLC
- Sue Yun Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for strain monitoring of printed circuit board...
- Publication number 20070205791
- Publication date Sep 6, 2007
- Cisco Technology, Inc.
- Mudasir Ahmad
- G01 - MEASURING TESTING