SUEANN LIM WEI FEN

Person

MELAKA, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit package fabrication
- Patent number 9,859,197
- Issue date Jan 2, 2018
- Texas Instruments Incorporated
- Lee Han Meng@ Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe strip with vertically offset die attach pads between adja...
- Patent number 9,741,643
- Issue date Aug 22, 2017
- Texas Instruments Incorporated
- Lee Han Meng@Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming a panel of triple stack semiconductor packages
- Patent number 9,691,748
- Issue date Jun 27, 2017
- Texas Instruments Incorporated
- Lee Han Meng @ Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device having leadframe features preventing...
- Patent number 9,515,009
- Issue date Dec 6, 2016
- Texas Instruments Incorporated
- Sueann Lim Wei Fen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flippable leadframe for packaged electronic system having verticall...
- Patent number 9,496,206
- Issue date Nov 15, 2016
- Texas Instruments Incorporated
- Lee Han Meng @ Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Triple stack semiconductor package
- Patent number 9,324,640
- Issue date Apr 26, 2016
- Texas Instruments Incorporated
- Lee Han Meng @ Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame with abutment surface
- Patent number 9,184,119
- Issue date Nov 10, 2015
- Texas Instruments Incorporated
- Lee Han Meng@ Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method of making
- Patent number 9,013,028
- Issue date Apr 21, 2015
- Texas Instruments Incorporated
- Lee Han Meng@Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LEADFRAME STRIP WITH VERTICALLY OFFSET DIE ATTACH PADS BETWEEN ADJA...
- Publication number 20170213784
- Publication date Jul 27, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Lee Han Meng@Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT ASSEMBLY
- Publication number 20170110408
- Publication date Apr 20, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Lee Han Meng@ Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged Semiconductor Device Having Leadframe Features Preventing...
- Publication number 20170053814
- Publication date Feb 23, 2017
- TEXAS INSTRUMENTS INCORPORATED
- SUEANN LIM WEI FEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flippable Leadframe for Packaged Electronic System Having Verticall...
- Publication number 20170025332
- Publication date Jan 26, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Lee Han Meng@ Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIPPABLE LEADFRAME FOR PACKAGED ELECTRONIC SYSTEM HAVING VERTICALL...
- Publication number 20160300784
- Publication date Oct 13, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Lee Han Meng@ Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICE HAVING LEADFRAME FEATURES PREVENTING...
- Publication number 20160204052
- Publication date Jul 14, 2016
- TEXAS INSTRUMENTS INCORPORATED
- SUEANN LIM WEI FEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAKING A FLAT NO-LEAD PACKAGE WITH EXPOSED ELECTROPLATED SIDE LEAD...
- Publication number 20160181122
- Publication date Jun 23, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Lee Han Meng@ Eugene Lee
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TRIPLE STACK SEMICONDUCTOR PACKAGE
- Publication number 20160126230
- Publication date May 5, 2016
- TEXAS INSTRUMENTS INCORPORATED
- LEE HAN MENG @ EUGENE LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME WITH ABUTMENT SURFACE
- Publication number 20150228563
- Publication date Aug 13, 2015
- TEXAS INSTRUMENTS INCORPORATED
- Lee Han Meng@ Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE FABRICATION
- Publication number 20150228581
- Publication date Aug 13, 2015
- TEXAS INSTRUMENTS INCORPORATED
- Lee Han Meng@ Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCKING DUAL LEADFRAME FOR FLIP CHIP ON LEADFRAME PACKAGES
- Publication number 20150060123
- Publication date Mar 5, 2015
- TEXAS INSTRUMENTS INCORPORATED
- LEE HAN MENG @ EUGENE LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF MAKING
- Publication number 20140191380
- Publication date Jul 10, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Lee Han Meng@Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS

SUEANN LIM WEI FEN

Person

Patents Grantslast 30 patents

Integrated circuit package fabrication

Leadframe strip with vertically offset die attach pads between adja...

Forming a panel of triple stack semiconductor packages

Packaged semiconductor device having leadframe features preventing...

Flippable leadframe for packaged electronic system having verticall...

Triple stack semiconductor package

Lead frame with abutment surface

Integrated circuit package and method of making

Patents Applicationslast 30 patents

LEADFRAME STRIP WITH VERTICALLY OFFSET DIE ATTACH PADS BETWEEN ADJA...

INTEGRATED CIRCUIT ASSEMBLY

Packaged Semiconductor Device Having Leadframe Features Preventing...

Flippable Leadframe for Packaged Electronic System Having Verticall...

FLIPPABLE LEADFRAME FOR PACKAGED ELECTRONIC SYSTEM HAVING VERTICALL...

PACKAGED SEMICONDUCTOR DEVICE HAVING LEADFRAME FEATURES PREVENTING...

MAKING A FLAT NO-LEAD PACKAGE WITH EXPOSED ELECTROPLATED SIDE LEAD...

TRIPLE STACK SEMICONDUCTOR PACKAGE

LEAD FRAME WITH ABUTMENT SURFACE

INTEGRATED CIRCUIT PACKAGE FABRICATION

LOCKING DUAL LEADFRAME FOR FLIP CHIP ON LEADFRAME PACKAGES

INTEGRATED CIRCUIT PACKAGE AND METHOD OF MAKING