Suguru Warashina

Person

Kawasaki-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Surface acoustic wave device and method of fabricating the same
- Patent number RE45419
- Issue date Mar 17, 2015
- Taiyo Yuden Co., Ltd.
- Osamu Kawachi
- 333 - Wave transmission lines and networks
Information Patent Grant
Acoustic wave device, duplexer, communication module, communication...
- Patent number 8,258,891
- Issue date Sep 4, 2012
- Taiyo Yuden Co., Ltd.
- Michio Miura
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Acoustic wave element, duplexer, communication module, and communic...
- Patent number 8,222,972
- Issue date Jul 17, 2012
- Taiyo Yuden Co., Ltd.
- Kazunori Inoue
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Elastic wave device with a dielectric layer on the comb-shaped elec...
- Patent number 8,085,116
- Issue date Dec 27, 2011
- Taiyo Yuden Co., Ltd.
- Michio Miura
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Planar surface acoustic wave device, communication module, and comm...
- Patent number 7,977,848
- Issue date Jul 12, 2011
- Taiyo Yuden Co., Ltd.
- Suguru Warashina
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Downsized package for electric wave device
- Patent number 7,291,904
- Issue date Nov 6, 2007
- Fujitsu Media Devices Limited
- Takashi Matsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface acoustic wave device and method of fabricating the same
- Patent number 7,274,129
- Issue date Sep 25, 2007
- Fujitsu Media Devices Limited
- Masanori Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface acoustic wave device and method of fabricating the same
- Patent number 7,227,429
- Issue date Jun 5, 2007
- Fujitsu Media Devices Limited
- Osamu Kawachi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Angular velocity sensor
- Patent number 7,188,525
- Issue date Mar 13, 2007
- Fujitsu Limited
- Atsushi Machida
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 5,801,081
- Issue date Sep 1, 1998
- Fujitsu Ltd.
- Suguru Warashina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 5,698,885
- Issue date Dec 16, 1997
- Fujitsu Limited
- Suguru Warashina
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ACOUSTIC WAVE DEVICE, DUPLEXER, COMMUNICATION MODULE, COMMUNICATION...
- Publication number 20100219906
- Publication date Sep 2, 2010
- FUJITSU LIMITED
- Michio MIURA
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ACOUSTIC WAVE DEVICE, COMMUNICATION MODULE, AND COMMUNICATION APPAR...
- Publication number 20100148626
- Publication date Jun 17, 2010
- FUJITSU LIMITED
- Suguru Warashina
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ACOUSTIC WAVE ELEMENT, DUPLEXER, COMMUNICATION MODULE, AND COMMUNIC...
- Publication number 20100148890
- Publication date Jun 17, 2010
- FUJITSU LIMITED
- Kazunori Inoue
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ELASTIC WAVE DEVICE
- Publication number 20090267707
- Publication date Oct 29, 2009
- FUJITSU LIMITED
- Michio Miura
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ELASTIC WAVE DEVICE, FILTER DEVICE, COMMUNICATION MODULE AND COMMUN...
- Publication number 20090152982
- Publication date Jun 18, 2009
- FUJITSU LIMITED
- Michio MIURA
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Elastic wave device and package substrate
- Publication number 20050242420
- Publication date Nov 3, 2005
- FUJITSU MEDIA DEVICES LIMITED
- Takashi Matsuda
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Acoustic wave device and method of fabricating the same
- Publication number 20050116352
- Publication date Jun 2, 2005
- Suguru Warashina
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Surface acoustic wave device and method of fabricating the same
- Publication number 20040217670
- Publication date Nov 4, 2004
- Masanori Ueda
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Surface acoustic wave device and method of fabricating the same
- Publication number 20040207485
- Publication date Oct 21, 2004
- Osamu Kawachi
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Surface acoustic wave device and method of fabricating the same
- Publication number 20040189146
- Publication date Sep 30, 2004
- FUJITSU MEDIA DEVICES LIMITED
- Masanori Ueda
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Angular velocity sensor
- Publication number 20030066350
- Publication date Apr 10, 2003
- FUJITSU LIMITED
- Atsushi Machida
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20010019155
- Publication date Sep 6, 2001
- SUGURU WARASHINA
- H01 - BASIC ELECTRIC ELEMENTS

Suguru Warashina

Person

Patents Grantslast 30 patents

Surface acoustic wave device and method of fabricating the same

Acoustic wave device, duplexer, communication module, communication...

Acoustic wave element, duplexer, communication module, and communic...

Elastic wave device with a dielectric layer on the comb-shaped elec...

Planar surface acoustic wave device, communication module, and comm...

Downsized package for electric wave device

Surface acoustic wave device and method of fabricating the same

Surface acoustic wave device and method of fabricating the same

Angular velocity sensor

Semiconductor device and method of manufacturing semiconductor device

Semiconductor device and method of manufacturing semiconductor device

Patents Applicationslast 30 patents

ACOUSTIC WAVE DEVICE, DUPLEXER, COMMUNICATION MODULE, COMMUNICATION...

ACOUSTIC WAVE DEVICE, COMMUNICATION MODULE, AND COMMUNICATION APPAR...

ACOUSTIC WAVE ELEMENT, DUPLEXER, COMMUNICATION MODULE, AND COMMUNIC...

ELASTIC WAVE DEVICE

ELASTIC WAVE DEVICE, FILTER DEVICE, COMMUNICATION MODULE AND COMMUN...

Elastic wave device and package substrate

Acoustic wave device and method of fabricating the same

Surface acoustic wave device and method of fabricating the same

Surface acoustic wave device and method of fabricating the same

Surface acoustic wave device and method of fabricating the same

Angular velocity sensor

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE