Sui-An Kao

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Taichung, TW

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure and fabrication method thereof
- Patent number 8,866,293
- Issue date Oct 21, 2014
- Siliconware Precision Industries Co., Ltd.
- Yi-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip structure having redistribution layer
- Patent number 8,772,922
- Issue date Jul 8, 2014
- Siliconware Precision Industries Co., Ltd.
- Hung-Yuan Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip structure having redistribution layer and fabrication method t...
- Patent number 8,097,491
- Issue date Jan 17, 2012
- Siliconware Precision Industries Co., Ltd.
- Hung-Yuan Hsu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR STRUCTURE
- Publication number 20150072517
- Publication date Mar 12, 2015
- Siliconware Precision Industries Co., Ltd.
- Yi-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20120280384
- Publication date Nov 8, 2012
- Siliconware Precision Industries Co., Ltd.
- Yi-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE HAVING REDISTRIBUTION LAYER
- Publication number 20120112363
- Publication date May 10, 2012
- Siliconware Precision Industries Co., Ltd.
- Hung-Yuan Hsu
- H01 - BASIC ELECTRIC ELEMENTS