Membership
Tour
Register
Log in
Sujit Sharan
Follow
Person
Chandler, AZ, US
People
Overview
Industries
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Multi-chip package and method of providing die-to-die interconnects...
Patent number
11,876,053
Issue date
Jan 16, 2024
Intel Corporation
Henning Braunisch
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Alternative surfaces for conductive pad layers of silicon bridges f...
Patent number
11,848,259
Issue date
Dec 19, 2023
Intel Corporation
Dae-Woo Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-chip package and method of providing die-to-die interconnects...
Patent number
11,824,008
Issue date
Nov 21, 2023
Intel Corporation
Henning Braunisch
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Nested architectures for enhanced heterogeneous integration
Patent number
11,798,865
Issue date
Oct 24, 2023
Intel Corporation
Ravindranath Mahajan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Rounded metal trace corner for stress reduction
Patent number
11,784,150
Issue date
Oct 10, 2023
Intel Corporation
Dae-Woo Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Nested architectures for enhanced heterogeneous integration
Patent number
11,742,261
Issue date
Aug 29, 2023
Intel Corporation
Ravindranath Mahajan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Capacitor die embedded in package substrate for providing capacitan...
Patent number
11,728,294
Issue date
Aug 15, 2023
Intel Corporation
Andrew Collins
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Horizontal pitch translation using embedded bridge dies
Patent number
11,694,952
Issue date
Jul 4, 2023
Intel Corporation
Sujit Sharan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Guard ring design enabling in-line testing of silicon bridges for s...
Patent number
11,676,889
Issue date
Jun 13, 2023
Intel Corporation
Arnab Sarkar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Metal-free frame design for silicon bridges for semiconductor packages
Patent number
11,626,372
Issue date
Apr 11, 2023
Intel Corporation
Dae-Woo Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interconnect hub for dies
Patent number
11,621,223
Issue date
Apr 4, 2023
Intel Corporation
Andrew Collins
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bridge hub tiling architecture
Patent number
11,569,173
Issue date
Jan 31, 2023
Intel Corporation
Andrew P. Collins
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multilevel die complex with integrated discrete passive components
Patent number
11,462,521
Issue date
Oct 4, 2022
Intel Corporation
Andrew P. Collins
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Embedded very high density (VHD) layer
Patent number
11,387,187
Issue date
Jul 12, 2022
Intel Corporation
Andrew Paul Collins
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Rounded metal trace corner for stress reduction
Patent number
11,380,643
Issue date
Jul 5, 2022
Intel Corporation
Dae-Woo Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Device, method and system for providing recessed interconnect struc...
Patent number
11,355,427
Issue date
Jun 7, 2022
Intel Corporation
Howe Yin Loo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
EMIB copper layer for signal and power routing
Patent number
11,322,445
Issue date
May 3, 2022
Intel Corporation
Yidnekachew S. Mekonnen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Horizontal pitch translation using embedded bridge dies
Patent number
11,276,635
Issue date
Mar 15, 2022
Intel Corporation
Sujit Sharan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Guard ring design enabling in-line testing of silicon bridges for s...
Patent number
11,257,743
Issue date
Feb 22, 2022
Intel Corporation
Arnab Sarkar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Low-inductance current paths for on-package power distributions and...
Patent number
11,222,837
Issue date
Jan 11, 2022
Intel Corporation
Andrew Collins
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Enabling long interconnect bridges
Patent number
11,222,847
Issue date
Jan 11, 2022
Intel Corporation
Ravindranath V. Mahajan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Capacitor die embedded in package substrate for providing capacitan...
Patent number
11,195,805
Issue date
Dec 7, 2021
Intel Corporation
Andrew Collins
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Signal routing carrier
Patent number
11,114,394
Issue date
Sep 7, 2021
Intel Corporation
Lijiang Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Passive components in vias in a stacked integrated circuit package
Patent number
11,031,288
Issue date
Jun 8, 2021
Intel Corporation
Sujit Sharan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Projecting contacts and method for making the same
Patent number
10,978,423
Issue date
Apr 13, 2021
Intel Corporation
Dae-Woo Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-chip package and method of providing die-to-die interconnects...
Patent number
10,923,429
Issue date
Feb 16, 2021
Intel Corporation
Henning Braunisch
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Metal-free frame design for silicon bridges for semiconductor packages
Patent number
10,916,514
Issue date
Feb 9, 2021
Intel Corporation
Dae-Woo Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Rounded metal trace corner for stress reduction
Patent number
10,797,014
Issue date
Oct 6, 2020
Intel Corporation
Dae-Woo Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-chip package and method of providing die-to-die interconnects...
Patent number
10,763,216
Issue date
Sep 1, 2020
Intel Corporation
Henning Braunisch
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Low-inductance current paths for on-package power distributions and...
Patent number
10,651,117
Issue date
May 12, 2020
Intel Corporation
Andrew Collins
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
NESTED ARCHITECTURES FOR ENHANCED HETEROGENEOUS INTEGRATION
Publication number
20240128162
Publication date
Apr 18, 2024
Intel Corporation
Ravindranath MAHAJAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ALTERNATIVE SURFACES FOR CONDUCTIVE PAD LAYERS OF SILICON BRIDGES F...
Publication number
20240071884
Publication date
Feb 29, 2024
Intel Corporation
Dae-Woo KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...
Publication number
20240038671
Publication date
Feb 1, 2024
Intel Corporation
Henning BRAUNISCH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERCONNECT BRIDGE WITH SIMILAR CHANNEL LENGTHS
Publication number
20240006323
Publication date
Jan 4, 2024
Intel Corporation
Lijiang Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LAYER SELECTION FOR ROUTING HIGH-SPEED SIGNALS IN SUBSTRATES
Publication number
20240006286
Publication date
Jan 4, 2024
Intel Corporation
Arghya Sain
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
NESTED ARCHITECTURES FOR ENHANCED HETEROGENEOUS INTEGRATION
Publication number
20230411245
Publication date
Dec 21, 2023
Intel Corporation
Ravindranath MAHAJAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CAPACITOR DIE EMBEDDED IN PACKAGE SUBSTRATE FOR PROVIDING CAPACITAN...
Publication number
20230343731
Publication date
Oct 26, 2023
Intel Corporation
Andrew COLLINS
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PASSIVE ELECTRICAL COMPONENTS IN MOLD METAL LAYERS OF A MULTI-DIE C...
Publication number
20230299044
Publication date
Sep 21, 2023
Intel Corporation
Andrew P. Collins
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
GUARD RING DESIGN ENABLING IN-LINE TESTING OF SILICON BRIDGES FOR S...
Publication number
20230260884
Publication date
Aug 17, 2023
Intel Corporation
Arnab SARKAR
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METAL-FREE FRAME DESIGN FOR SILICON BRIDGES FOR SEMICONDUCTOR PACKAGES
Publication number
20230238339
Publication date
Jul 27, 2023
Intel Corporation
Dae-Woo KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METAL-FREE FRAME DESIGN FOR SILICON BRIDGES FOR SEMICONDUCTOR PACKAGES
Publication number
20230223361
Publication date
Jul 13, 2023
Intel Corporation
Dae-Woo KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
NESTED ARCHITECTURES FOR ENHANCED HETEROGENEOUS INTEGRATION
Publication number
20230133429
Publication date
May 4, 2023
Intel Corporation
Ravindranath MAHAJAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BRIDGE HUB TILING ARCHITECTURE
Publication number
20230138386
Publication date
May 4, 2023
Intel Corporation
ANDREW P. COLLINS
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...
Publication number
20230016326
Publication date
Jan 19, 2023
Intel Corporation
Henning M. Braunisch
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ROUNDED METAL TRACE CORNER FOR STRESS REDUCTION
Publication number
20220285306
Publication date
Sep 8, 2022
Intel Corporation
Dae-Woo KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HIGH BANDWIDTH OPTICAL INTERCONNECTION ARCHITECTURES
Publication number
20220155539
Publication date
May 19, 2022
Intel Corporation
Srinivas V. PIETAMBARAM
G02 - OPTICS
Information
Patent Application
HORIZONTAL PITCH TRANSLATION USING EMBEDDED BRIDGE DIES
Publication number
20220157706
Publication date
May 19, 2022
Intel Corporation
Sujit SHARAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
GUARD RING DESIGN ENABLING IN-LINE TESTING OF SILICON BRIDGES FOR S...
Publication number
20220130743
Publication date
Apr 28, 2022
Intel Corporation
Arnab SARKAR
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ENABLING LONG INTERCONNECT BRIDGES
Publication number
20220130763
Publication date
Apr 28, 2022
Intel Corporation
Ravindranath V. Mahajan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CAPACITOR DIE EMBEDDED IN PACKAGE SUBSTRATE FOR PROVIDING CAPACITAN...
Publication number
20220059476
Publication date
Feb 24, 2022
Intel Corporation
Andrew COLLINS
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
EMIB COPPER LAYER FOR SIGNAL AND POWER ROUTING
Publication number
20210296240
Publication date
Sep 23, 2021
Yidnekachew S. Mekonnen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
EMIB ARCHITECTURE WITH DEDICATED METAL LAYERS FOR IMPROVING POWER D...
Publication number
20210280518
Publication date
Sep 9, 2021
Intel Corporation
Jianyong XIE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...
Publication number
20210134726
Publication date
May 6, 2021
Intel Corporation
Henning BRAUNISCH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METAL-FREE FRAME DESIGN FOR SILICON BRIDGES FOR SEMICONDUCTOR PACKAGES
Publication number
20210125942
Publication date
Apr 29, 2021
Intel Corporation
Dae-Woo KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SIGNAL ROUTING CARRIER
Publication number
20210043588
Publication date
Feb 11, 2021
Intel Corporation
Lijiang Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ROUNDED METAL TRACE CORNER FOR STRESS REDUCTION
Publication number
20200402940
Publication date
Dec 24, 2020
Intel Corporation
Dae-Woo KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATELESS DOUBLE-SIDED EMBEDDED MULTI-DIE INTERCONNECT BRIDGE
Publication number
20200395300
Publication date
Dec 17, 2020
Intel Corporation
Biancun Xie
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HORIZONTAL PITCH TRANSLATION USING EMBEDDED BRIDGE DIES
Publication number
20200381350
Publication date
Dec 3, 2020
Intel Corporation
Sujit SHARAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERCONNECT HUB FOR DIES
Publication number
20200373235
Publication date
Nov 26, 2020
Intel Corporation
Andrew COLLINS
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...
Publication number
20200357747
Publication date
Nov 12, 2020
Intel Corporation
Henning BRAUNISCH
H01 - BASIC ELECTRIC ELEMENTS