Suk Chul Bang

Person

Gyeonggi-do, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and semiconductor package
- Patent number 9,490,216
- Issue date Nov 8, 2016
- Samsung Electronics Co., Ltd.
- Kwang-Jin Moon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit devices having through silicon via structures an...
- Patent number 9,379,042
- Issue date Jun 28, 2016
- Samsung Electronics Co., Ltd.
- Jae-hwa Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit devices including a through-silicon via structur...
- Patent number 9,214,411
- Issue date Dec 15, 2015
- Samsung Electronics Co., Ltd.
- Jae-Hwa Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device having through-silicon-via structure and...
- Patent number 9,142,490
- Issue date Sep 22, 2015
- Samsung Electronics Co., Ltd.
- Jae-hwa Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit having through silicon via structure with minimi...
- Patent number 9,018,768
- Issue date Apr 28, 2015
- Samsung Electronics Co., Ltd.
- Byung-Lyul Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode connecting structures containing copper
- Patent number 8,860,221
- Issue date Oct 14, 2014
- Samsung Electronics Co., Ltd.
- Kun-Sang Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 8,847,399
- Issue date Sep 30, 2014
- Samsung Electronics Co., Ltd.
- Byung-Lyul Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing a semiconductor device
- Patent number 8,592,310
- Issue date Nov 26, 2013
- Samsung Electronics Co., Ltd.
- Byung-Lyul Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor device
- Patent number 8,546,256
- Issue date Oct 1, 2013
- Samsung Electronics Co., Ltd.
- Deok-Young Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device and method of manufa...
- Patent number 8,497,157
- Issue date Jul 30, 2013
- Samsung Electronics Co., Ltd.
- Kwang-Jin Moon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor device and related method
- Patent number 8,419,853
- Issue date Apr 16, 2013
- Samsung Electronics Co., Ltd.
- Yun-Seung Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same including a...
- Patent number 8,076,234
- Issue date Dec 13, 2011
- Samsung Electronics Co., Ltd.
- Byung-Lyul Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor device and related method
- Patent number 7,682,450
- Issue date Mar 23, 2010
- Samsung Electronics Co., Ltd.
- Yun-Seung Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 7,585,757
- Issue date Sep 8, 2009
- Samsung Electronics Co., Ltd.
- Jong-Seon Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating CMOS transistor that prevents gate thinning
- Patent number 7,268,029
- Issue date Sep 11, 2007
- Samsung Electronics Co., Ltd.
- Eun-kuk Chung
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE
- Publication number 20150287683
- Publication date Oct 8, 2015
- Samsung Electronics Co., Ltd.
- KWANG-JIN MOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Devices Having Through Silicon Via Structures an...
- Publication number 20150108605
- Publication date Apr 23, 2015
- Jae-hwa PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Devices Including a Through-Silicon Via Structur...
- Publication number 20150102497
- Publication date Apr 16, 2015
- Jae-Hwa Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE HAVING THROUGH-SILICON-VIA STRUCTURE AND...
- Publication number 20150028494
- Publication date Jan 29, 2015
- Jae-hwa PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE INCLUDING THROUGH-SILICON VIA STRUCTURE A...
- Publication number 20150028450
- Publication date Jan 29, 2015
- Jae-hwa PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING A SEMICONDUCTOR DEVICE
- Publication number 20130337647
- Publication date Dec 19, 2013
- Samsung Electronics Co., Ltd.
- Deok-young Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Fabricating the Same
- Publication number 20130187287
- Publication date Jul 25, 2013
- Byung-Lyul Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrode Connecting Structures Containing Copper
- Publication number 20130140697
- Publication date Jun 6, 2013
- Samsung Electronics Co., Ltd.
- Kun-Sang Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND METHOD OF MANUFA...
- Publication number 20120282736
- Publication date Nov 8, 2012
- Kwang-Jin MOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20120142185
- Publication date Jun 7, 2012
- Samsung Electronics Co., Ltd.
- Byung-lyul Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20120132986
- Publication date May 31, 2012
- Pil-Kyu Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Fabricating the Same
- Publication number 20120043666
- Publication date Feb 23, 2012
- Byung-Lyul Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING SEMICONDUCTOR DEVICE
- Publication number 20110318922
- Publication date Dec 29, 2011
- Samsung Electronics Co., Ltd.
- Deok-young Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME INCLUDING A...
- Publication number 20110318923
- Publication date Dec 29, 2011
- Byung-Lyul Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICE AND RELATED METHOD
- Publication number 20100065912
- Publication date Mar 18, 2010
- Samsung Electronics Co., Ltd.
- Yun-Seung KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor memory device and method of manufacturing the same
- Publication number 20080087933
- Publication date Apr 17, 2008
- Eun-Kuk Chung
- B82 - NANO-TECHNOLOGY
Information Patent Application
CAPACITOR OF SEMICONDUCTOR DEVICE APPLYING DAMASCENE PROCESS AND ME...
- Publication number 20070281434
- Publication date Dec 6, 2007
- Samsung Electronics Co., Ltd.
- Jong-Seon AHN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked semiconductor device and related method
- Publication number 20070023794
- Publication date Feb 1, 2007
- Yun-Seung Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20060281290
- Publication date Dec 14, 2006
- Jong-Seon Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Capacitor of semiconductor device applying damascene process and me...
- Publication number 20050110143
- Publication date May 26, 2005
- Jong-Seon Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of fabricating CMOS transistor that prevents gate thinning
- Publication number 20050112814
- Publication date May 26, 2005
- Eun-kuk Chung
- H01 - BASIC ELECTRIC ELEMENTS

Suk Chul Bang

Person

Patents Grantslast 30 patents

Semiconductor device and semiconductor package

Integrated circuit devices having through silicon via structures an...

Integrated circuit devices including a through-silicon via structur...

Integrated circuit device having through-silicon-via structure and...

Integrated circuit having through silicon via structure with minimi...

Electrode connecting structures containing copper

Semiconductor device and method of fabricating the same

Methods of manufacturing a semiconductor device

Method of forming semiconductor device

Method of manufacturing a semiconductor device and method of manufa...

Stacked semiconductor device and related method

Semiconductor device and method of fabricating the same including a...

Stacked semiconductor device and related method

Semiconductor device and method of manufacturing the same

Method of fabricating CMOS transistor that prevents gate thinning

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE

Integrated Circuit Devices Having Through Silicon Via Structures an...

Integrated Circuit Devices Including a Through-Silicon Via Structur...

INTEGRATED CIRCUIT DEVICE HAVING THROUGH-SILICON-VIA STRUCTURE AND...

INTEGRATED CIRCUIT DEVICE INCLUDING THROUGH-SILICON VIA STRUCTURE A...

METHODS OF FORMING A SEMICONDUCTOR DEVICE

Semiconductor Device and Method of Fabricating the Same

Electrode Connecting Structures Containing Copper

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND METHOD OF MANUFA...

METHODS OF MANUFACTURING A SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME

Semiconductor Device and Method of Fabricating the Same

METHOD OF FORMING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME INCLUDING A...

STACKED SEMICONDUCTOR DEVICE AND RELATED METHOD

Semiconductor memory device and method of manufacturing the same

CAPACITOR OF SEMICONDUCTOR DEVICE APPLYING DAMASCENE PROCESS AND ME...

Stacked semiconductor device and related method

Semiconductor device and method of manufacturing the same

Capacitor of semiconductor device applying damascene process and me...

Method of fabricating CMOS transistor that prevents gate thinning