Suk Jin Ham

Person

Suwon, KR

People

Patents Grantslast 30 patents

Information Patent Grant
System of measuring warpage and method of measuring warpage
- Patent number 9,470,635
- Issue date Oct 18, 2016
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Seung Wan Woo
- G01 - MEASURING TESTING
Information Patent Grant
Apparatus for testing switching of power semiconductor module
- Patent number 9,279,861
- Issue date Mar 8, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Shang Hoon Seo
- G01 - MEASURING TESTING
Information Patent Grant
Multilayer ceramic electronic component and method of manufacturing...
- Patent number 9,263,187
- Issue date Feb 16, 2016
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Kwang Jik Lee
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method of manufacturing printed circuit board
- Patent number 9,192,050
- Issue date Nov 17, 2015
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Sung Yeol Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Touch sensor
- Patent number 9,189,105
- Issue date Nov 17, 2015
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Hee Jin Park
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Apparatus and method for testing semiconductor device
- Patent number 9,164,145
- Issue date Oct 20, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Shang Hoon Seo
- G01 - MEASURING TESTING
Information Patent Grant
Electronic component package
- Patent number 9,155,192
- Issue date Oct 6, 2015
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Kyung Ho Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
In nanowire, device using the same and method of manufacturing in n...
- Patent number 9,099,329
- Issue date Aug 4, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Hee Suk Chung
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Printed circuit board and method of manufacturing the same
- Patent number 9,095,063
- Issue date Jul 28, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Eun Ju Yang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Organic light emitting device with a protective layer including at...
- Patent number 9,065,071
- Issue date Jun 23, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Kwang Jik Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulating composition for substrate, and prepreg and substrate usi...
- Patent number 9,045,646
- Issue date Jun 2, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Soo Young Ji
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Touch panel and producing method for via electrode
- Patent number 9,030,432
- Issue date May 12, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Sung Yeol Park
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multilayer thin film for ceramic electronic component and method of...
- Patent number 8,974,901
- Issue date Mar 10, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Kwang Jik Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Insulating layer composition for substrate, and prepreg and substra...
- Patent number 8,940,186
- Issue date Jan 27, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Soo Young Ji
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Ceramic sheet product for ceramic electronic component, multilayer...
- Patent number 8,755,167
- Issue date Jun 17, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Kwang Jik Lee
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Light emitting device and method of manufacturing the same
- Patent number 8,013,349
- Issue date Sep 6, 2011
- Samsung Electronics Co., Ltd.
- Seung Tae Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level incapsulation chip and encapsulation chip manufacturing...
- Patent number 7,906,841
- Issue date Mar 15, 2011
- Samsung Electronics Co., Ltd.
- Byung-gil Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level package for surface acoustic wave device and fabricatio...
- Patent number 7,755,151
- Issue date Jul 13, 2010
- Samsung Electronics Co., Ltd.
- Ji-hyuk Lim
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Wafer level packaging cap and fabrication method thereof
- Patent number 7,449,366
- Issue date Nov 11, 2008
- Samsung Electronics Co., Ltd.
- Moon-chul Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaging chip and packaging method thereof
- Patent number 7,408,257
- Issue date Aug 5, 2008
- Samsung Electronics Co., Ltd.
- Kyu-dong Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-package, multi-stack micro-package, and manufacturing method...
- Patent number 7,374,972
- Issue date May 20, 2008
- Samsung Electronics Co., Ltd.
- Jong-oh Kwon
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro-package, multi-stack micro-package, and manufacturing method...
- Patent number 7,285,865
- Issue date Oct 23, 2007
- Samsung Electronic Co., Ltd.
- Jong-oh Kwon
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF BONDING ELECTRONIC COMPONENTS AND ELECTRONIC DEVICE USING...
- Publication number 20150163924
- Publication date Jun 11, 2015
- Samsung Electro-mechanics Co., Ltd.
- Hye Jin CHO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER THIN FILM FOR CERAMIC ELECTRONIC COMPONENT AND METHOD FO...
- Publication number 20150162134
- Publication date Jun 11, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Kwang Jik LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20150136458
- Publication date May 21, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Eun Ju Yang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
BONDING FORCE TEST DEVICE
- Publication number 20150114131
- Publication date Apr 30, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Jin Uk Cha
- G01 - MEASURING TESTING
Information Patent Application
IMAGE SENSOR MODULE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140374870
- Publication date Dec 25, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Kyung Ho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CALIBRATION BLOCK FOR MEASURING WARPAGE, WARPAGE MEASURING APPARATU...
- Publication number 20140354797
- Publication date Dec 4, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Seung Wan Woo
- G01 - MEASURING TESTING
Information Patent Application
MOISTURE TRANSMISSION TESTING INSTRUMENT
- Publication number 20140352413
- Publication date Dec 4, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Hee Jin PARK
- G01 - MEASURING TESTING
Information Patent Application
INSULATION MATERIALS, INSULATION COMPOSITION COMPRISING THE SAME, A...
- Publication number 20140187687
- Publication date Jul 3, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Soo Young JI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TOUCH PANEL AND PRODUCING METHOD FOR VIA ELECTRODE
- Publication number 20140184933
- Publication date Jul 3, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Sung Yeol Park
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEM OF MEASURING WARPAGE AND METHOD OF MEASURING WARPAGE
- Publication number 20140184782
- Publication date Jul 3, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Seung Wan WOO
- G01 - MEASURING TESTING
Information Patent Application
THERMALLY CONDUCTIVE FILM AND CIRCUIT BOARD MODULE
- Publication number 20140185244
- Publication date Jul 3, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Jae Sang LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRY FILM PHOTORESIST HAVING OXYGEN PERMEABLE BARRIER LAYER AND MANU...
- Publication number 20140178814
- Publication date Jun 26, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Hyo Jin YOON
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
APPARATUS FOR TESTING SWITCHING OF POWER SEMICONDUCTOR MODULE
- Publication number 20140176180
- Publication date Jun 26, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Shang Hoon Seo
- G01 - MEASURING TESTING
Information Patent Application
TOUCH PANEL
- Publication number 20140176828
- Publication date Jun 26, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Jung Eun Noh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD, APPARATUS AND SAMPLE FOR EVALUATING BONDING STRENGTH
- Publication number 20140174193
- Publication date Jun 26, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Gyu Seok KIM
- G01 - MEASURING TESTING
Information Patent Application
TOUCH SENSOR
- Publication number 20140176506
- Publication date Jun 26, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Hee Jin PARK
- G02 - OPTICS
Information Patent Application
INSULATING COMPOSITION, SUBSTRATE INCLUDING INSULATING LAYER USING...
- Publication number 20140170412
- Publication date Jun 19, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Soo Young JI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
TOUCH PANEL
- Publication number 20140158507
- Publication date Jun 12, 2014
- Sumsung Electro-Mechanics Co., Ltd.
- Sung Yeol Park
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INSPECTION DEVICE FOR SUBSTRATE DEFORMATION AT HIGH TEMPERATURES AN...
- Publication number 20140152980
- Publication date Jun 5, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Gyu Seok KIM
- G01 - MEASURING TESTING
Information Patent Application
METHOD OF ANALYZING ALDEHYDE COMPOUND IN METAL PLATING SOLUTION
- Publication number 20140147926
- Publication date May 29, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Ji Eun Jeon
- G01 - MEASURING TESTING
Information Patent Application
ELECTRONIC COMPONENT PACKAGE
- Publication number 20140146498
- Publication date May 29, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Kyung Ho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140145322
- Publication date May 29, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Young Nam Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATION LAYER TYPE SEMICONDUCTOR PACKAGE
- Publication number 20140145323
- Publication date May 29, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Kyung Ho LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD OF TESTING SEMICONDUCTOR MODULE
- Publication number 20140140373
- Publication date May 22, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Shang Hoon Seo
- G01 - MEASURING TESTING
Information Patent Application
PRINTED CIRCUIT BOARD HAVING ELECTRONIC COMPONENT EMBEDDED THEREIN
- Publication number 20140138138
- Publication date May 22, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Sung Yeol Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN NANOWIRE, DEVICE USING THE SAME AND METHOD OF MANUFACTURING In N...
- Publication number 20140138611
- Publication date May 22, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Hee Suk CHUNG
- B82 - NANO-TECHNOLOGY
Information Patent Application
MEASUREMENT DEVICE OF DEGREE OF CURE
- Publication number 20140139835
- Publication date May 22, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Ji Hoon KIM
- G01 - MEASURING TESTING
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140131081
- Publication date May 15, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Hye Jin Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD
- Publication number 20140130347
- Publication date May 15, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Sung Yeol PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND METHOD FOR TESTING SEMICONDUCTOR DEVICE
- Publication number 20140133100
- Publication date May 15, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Shang Hoon SEO
- G01 - MEASURING TESTING

Suk Jin Ham

Person

Patents Grantslast 30 patents

System of measuring warpage and method of measuring warpage

Apparatus for testing switching of power semiconductor module

Multilayer ceramic electronic component and method of manufacturing...

Method of manufacturing printed circuit board

Touch sensor

Apparatus and method for testing semiconductor device

Electronic component package

In nanowire, device using the same and method of manufacturing in n...

Printed circuit board and method of manufacturing the same

Organic light emitting device with a protective layer including at...

Insulating composition for substrate, and prepreg and substrate usi...

Touch panel and producing method for via electrode

Multilayer thin film for ceramic electronic component and method of...

Insulating layer composition for substrate, and prepreg and substra...

Ceramic sheet product for ceramic electronic component, multilayer...

Light emitting device and method of manufacturing the same

Wafer level incapsulation chip and encapsulation chip manufacturing...

Wafer level package for surface acoustic wave device and fabricatio...

Wafer level packaging cap and fabrication method thereof

Packaging chip and packaging method thereof

Micro-package, multi-stack micro-package, and manufacturing method...

Micro-package, multi-stack micro-package, and manufacturing method...

Patents Applicationslast 30 patents

METHOD OF BONDING ELECTRONIC COMPONENTS AND ELECTRONIC DEVICE USING...

MULTILAYER THIN FILM FOR CERAMIC ELECTRONIC COMPONENT AND METHOD FO...

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

BONDING FORCE TEST DEVICE

IMAGE SENSOR MODULE AND METHOD OF MANUFACTURING THE SAME

CALIBRATION BLOCK FOR MEASURING WARPAGE, WARPAGE MEASURING APPARATU...

MOISTURE TRANSMISSION TESTING INSTRUMENT

INSULATION MATERIALS, INSULATION COMPOSITION COMPRISING THE SAME, A...

TOUCH PANEL AND PRODUCING METHOD FOR VIA ELECTRODE

SYSTEM OF MEASURING WARPAGE AND METHOD OF MEASURING WARPAGE

THERMALLY CONDUCTIVE FILM AND CIRCUIT BOARD MODULE

DRY FILM PHOTORESIST HAVING OXYGEN PERMEABLE BARRIER LAYER AND MANU...

APPARATUS FOR TESTING SWITCHING OF POWER SEMICONDUCTOR MODULE

TOUCH PANEL

METHOD, APPARATUS AND SAMPLE FOR EVALUATING BONDING STRENGTH

TOUCH SENSOR

INSULATING COMPOSITION, SUBSTRATE INCLUDING INSULATING LAYER USING...

TOUCH PANEL

INSPECTION DEVICE FOR SUBSTRATE DEFORMATION AT HIGH TEMPERATURES AN...

METHOD OF ANALYZING ALDEHYDE COMPOUND IN METAL PLATING SOLUTION

ELECTRONIC COMPONENT PACKAGE

ELECTRONIC COMPONENT PACKAGE AND METHOD OF MANUFACTURING THE SAME

LAMINATION LAYER TYPE SEMICONDUCTOR PACKAGE

APPARATUS AND METHOD OF TESTING SEMICONDUCTOR MODULE

PRINTED CIRCUIT BOARD HAVING ELECTRONIC COMPONENT EMBEDDED THEREIN

IN NANOWIRE, DEVICE USING THE SAME AND METHOD OF MANUFACTURING In N...

MEASUREMENT DEVICE OF DEGREE OF CURE

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD

APPARATUS AND METHOD FOR TESTING SEMICONDUCTOR DEVICE