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Patents Grantslast 30 patents

Information Patent Grant
Chip packaging method and chip package using hydrophobic surface
- Patent number 9,570,415
- Issue date Feb 14, 2017
- KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
- Hyo Hoon Park
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGING METHOD AND CHIP PACKAGE USING HYDROPHOBIC SURFACE
- Publication number 20150311177
- Publication date Oct 29, 2015
- Korea Advanced Institute of Science and Technology
- Hyo Hoon PARK
- H01 - BASIC ELECTRIC ELEMENTS