Sukhminder Binapal

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Burlington, CA

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Patents Grantslast 30 patents

Information Patent Grant
Three dimensional packaging configuration for multi-chip module ass...
- Patent number 6,133,626
- Issue date Oct 17, 2000
- Gennum Corporation
- Robert E. Hawke
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ULTRA THIN FLIP-CHIP BACKSIDE DEVICE SENSOR PACKAGE
- Publication number 20110210411
- Publication date Sep 1, 2011
- SOUND DESIGN TECHNOLOGIES, LTD.
- Sukhminder S. Binapal
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
System and method for providing environmental specific noise reduct...
- Publication number 20070041589
- Publication date Feb 22, 2007
- Gennum Corporation
- Atin Patel
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Communication headset with signal processing capability
- Publication number 20050090295
- Publication date Apr 28, 2005
- Gennum Corporation
- Kamal Ali
- H04 - ELECTRIC COMMUNICATION TECHNIQUE