SukMin KANG

Person

  • Gwangmyeong, KR

Patents Grantslast 30 patents

  • Information Patent Grant

    Molded interconnect device

    • Patent number 11,357,112
    • Issue date Jun 7, 2022
    • Molex, LLC
    • Tsuey Choo Chang
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents