SUKWON LEE

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YONGIN-SI, KR

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Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing a semiconductor package
- Patent number 11,848,301
- Issue date Dec 19, 2023
- Samsung Electronics Co., Ltd.
- Jonggu Lee
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Bonding head including a thermal compensator, die bonding apparatus...
- Patent number 11,626,381
- Issue date Apr 11, 2023
- Samsung Electronics Co., Ltd.
- Jonggu Lee
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor chip bonding apparatus including head having thermall...
- Patent number 11,607,741
- Issue date Mar 21, 2023
- Samsung Electronics Co., Ltd.
- Sebin Choi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding apparatus and substrate manufacturing equipment including t...
- Patent number 9,553,069
- Issue date Jan 24, 2017
- Samsung Electronics Co., Ltd.
- Ilyoung Han
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE
- Publication number 20230238351
- Publication date Jul 27, 2023
- Samsung Electronics Co., Ltd.
- Jonggu LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING HEAD, DIE BONDING APPARATUS INCLUDING THE SAME AND METHOD O...
- Publication number 20210098415
- Publication date Apr 1, 2021
- Samsung Electronics Co., Ltd.
- Jonggu LEE
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
SEMICONDUCTOR CHIP BONDING APPARATUS INCLUDING HEAD HAVING THERMALL...
- Publication number 20210069811
- Publication date Mar 11, 2021
- Samsung Electronics Co., Ltd.
- Sebin CHOI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING APPARATUS AND SUBSTRATE MANUFACTURING EQUIPMENT INCLUDING T...
- Publication number 20160118362
- Publication date Apr 28, 2016
- Samsung Electronics Co., Ltd.
- ILYOUNG HAN
- H01 - BASIC ELECTRIC ELEMENTS