Sumiko Nakajima

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Ibaraki, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method for surface treatment of copper and copper
- Patent number 8,809,696
- Issue date Aug 19, 2014
- Hitachi Chemical Company, Ltd.
- Tomoaki Yamashita
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroless gold plating solution and method for electroless plating
- Patent number 6,811,828
- Issue date Nov 2, 2004
- Hitachi Chemical Co., Ltd.
- Akio Takahashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroless copper plating solution
- Patent number 4,557,762
- Issue date Dec 10, 1985
- Hitachi Chemical Company
- Akishi Nakaso
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR SURFACE TREATMENT OF COPPER AND COPPER
- Publication number 20110147072
- Publication date Jun 23, 2011
- Tomoaki Yamashita
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Electroless gold plating solution and method for electroless plating
- Publication number 20040028833
- Publication date Feb 12, 2004
- Akio Takahashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...