TREA

Sumio KOIWA

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  • Tokyo, JP
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    THROUGH-HOLE ELECTRODE SUBSTRATE
    • Publication number 20220246512
    • Publication date Aug 4, 2022
    • DAI NIPPON PRINTING CO., LTD.
    • Satoru KURAMOCHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    THROUGH-HOLE ELECTRODE SUBSTRATE
    • Publication number 20200357733
    • Publication date Nov 12, 2020
    • DAI NIPPON PRINTING CO., LTD.
    • Satoru KURAMOCHI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    THROUGH-HOLE ELECTRODE SUBSTRATE
    • Publication number 20200152564
    • Publication date May 14, 2020
    • DAI NIPPON PRINTING CO., LTD.
    • Satoru KURAMOCHI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    THROUGH-HOLE ELECTRODE SUBSTRATE
    • Publication number 20190172780
    • Publication date Jun 6, 2019
    • DAI NIPPON PRINTING CO., LTD.
    • Satoru KURAMOCHI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    THROUGH ELECTRODE SUBSTRATE AND SEMICONDUCTOR DEVICE USING THROUGH...
    • Publication number 20160276257
    • Publication date Sep 22, 2016
    • DAI NIPPON PRINTING CO., LTD.
    • Satoru KURAMOCHI
    • H01 - BASIC ELECTRIC ELEMENTS