Sumio Okada

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Takasaki, JP

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Patents Grantslast 30 patents

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Process for manufacturing semiconductor integrated circuit device,...
- Patent number 5,304,512
- Issue date Apr 19, 1994
- Hitachi, Ltd.
- Katsuo Arai
- H01 - BASIC ELECTRIC ELEMENTS
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Resin-encapsulated semiconductor device having a particular mountin...
- Patent number 5,150,193
- Issue date Sep 22, 1992
- Hitachi, Ltd.
- Toshihiro Yasuhara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface mount plastic package semiconductor integrated circuit, man...
- Patent number 4,920,074
- Issue date Apr 24, 1990
- Hitachi, Ltd.
- Ichio Shimizu
- H01 - BASIC ELECTRIC ELEMENTS