Sumitomo Inomata

Person

Toyota-city, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Wafer processing method, wafer polishing apparatus, and ingot slici...
- Patent number 8,758,087
- Issue date Jun 24, 2014
- Denso Corporation
- Kyohei Koutake
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Semiconductor device and method for producing the same by dicing
- Patent number 7,091,109
- Issue date Aug 15, 2006
- Denso Corporation
- Tetsuo Fujii
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
High density energy beam machining method and apparatus for the same
- Patent number 6,495,796
- Issue date Dec 17, 2002
- Denso Corporation
- Terukazu Fukaya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device produced by dicing
- Patent number 6,429,506
- Issue date Aug 6, 2002
- Denso Corporation
- Tetsuo Fujii
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor device with a protective sheet to affix a semiconduct...
- Patent number 6,255,741
- Issue date Jul 3, 2001
- Denso Corporation
- Shinji Yoshihara
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for manufacturing a semiconductor device
- Patent number 5,824,177
- Issue date Oct 20, 1998
- Nippondenso Co., Ltd.
- Shinji Yoshihara
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
HIGH HARDNESS MATERIAL WORKING METHOD AND WORKING APPARATUS
- Publication number 20130217305
- Publication date Aug 22, 2013
- DENSO CORPORATION
- Kyohei KOUTAKE
- B24 - GRINDING POLISHING
Information Patent Application
WAFER PROCESSING METHOD, WAFER POLISHING APPARATUS, AND INGOT SLICI...
- Publication number 20110294403
- Publication date Dec 1, 2011
- DENSO CORPORATION
- Kyohei KOUTAKE
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHOD FOR FORMING PERIODIC STRUCTURE AND FUEL INJECTION SYSTEM HAV...
- Publication number 20110147493
- Publication date Jun 23, 2011
- DENSO CORPORATION
- Yoshihito MITSUOKA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and device for removing burr by high-density energy beam
- Publication number 20060065648
- Publication date Mar 30, 2006
- Michio Kameyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Laser beam machining equipment and method for machining by using la...
- Publication number 20050230370
- Publication date Oct 20, 2005
- DENSO CORPORATION
- Michio Kameyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and method for producing the same by dicing
- Publication number 20040259330
- Publication date Dec 23, 2004
- Tetsuo Fujii
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Semiconductor device and method for producing the same by dicing
- Publication number 20020093076
- Publication date Jul 18, 2002
- Tetsuo Fujii
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
High density energy beam machining method and apparatus for the same
- Publication number 20020023905
- Publication date Feb 28, 2002
- Terukazu Fukaya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Sumitomo Inomata

Person

Patents Grantslast 30 patents

Wafer processing method, wafer polishing apparatus, and ingot slici...

Semiconductor device and method for producing the same by dicing

High density energy beam machining method and apparatus for the same

Semiconductor device produced by dicing

Semiconductor device with a protective sheet to affix a semiconduct...

Method for manufacturing a semiconductor device

Patents Applicationslast 30 patents

HIGH HARDNESS MATERIAL WORKING METHOD AND WORKING APPARATUS

WAFER PROCESSING METHOD, WAFER POLISHING APPARATUS, AND INGOT SLICI...

METHOD FOR FORMING PERIODIC STRUCTURE AND FUEL INJECTION SYSTEM HAV...

Method and device for removing burr by high-density energy beam

Laser beam machining equipment and method for machining by using la...

Semiconductor device and method for producing the same by dicing

Semiconductor device and method for producing the same by dicing

High density energy beam machining method and apparatus for the same