Sumiyoshi Okada

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Nagano-ken, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method of cleaning semiconductor wafers after lapping
- Patent number 5,976,983
- Issue date Nov 2, 1999
- Shin-Etsu Handotai Co., Ltd.
- Seiichi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS