Sun Hee Hong

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Hillsborough, NJ, US

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Patents Grantslast 30 patents

Information Patent Grant
Underfill encapsulant for wafer packaging and method for its applic...
- Patent number 7,037,399
- Issue date May 2, 2006
- National Starch and Chemical Investment Holding Corporation
- Quinn K. Tong
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Dual cure B-stageable underfill for wafer level
- Patent number 6,833,629
- Issue date Dec 21, 2004
- National Starch and Chemical Investment Holding Corporation
- Bodan Ma
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
Underfill encapsulant for wafer packaging and method for its applic...
- Publication number 20030171456
- Publication date Sep 11, 2003
- Quinn K. Tong
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Dual cure B-stageable underfill for wafer level
- Publication number 20030141592
- Publication date Jul 31, 2003
- Bodan Ma
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...