Sun Kuen WONG

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New Territories, HK

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Patents Grantslast 30 patents

Information Patent Grant
Die bonder providing a large bonding force
- Patent number 8,651,159
- Issue date Feb 18, 2014
- ASM Assembly Automation LTD
- Sun Kuen Wong
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
DIE BONDER PROVIDING A LARGE BONDING FORCE
- Publication number 20100314050
- Publication date Dec 16, 2010
- Sun Kuen WONG
- H01 - BASIC ELECTRIC ELEMENTS