Sun-Mo Yang

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Cheonan-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 7,605,478
- Issue date Oct 20, 2009
- Samsung Electronics Co., Ltd.
- Kyung-Man Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for bonding a wire
- Patent number 7,371,675
- Issue date May 13, 2008
- Samsung Electronics Co., Ltd.
- In-Ku Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip stack structure
- Patent number 6,977,439
- Issue date Dec 20, 2005
- Samsung Electronics Co., Ltd.
- In-Ku Kang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100013083
- Publication date Jan 21, 2010
- Samsung Electronics Co., Ltd.
- Kyung-Man KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20080150167
- Publication date Jun 26, 2008
- Samsung Electronics Co., Ltd.
- Kyung-Man KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor chip stack structure and method for forming the same
- Publication number 20060049528
- Publication date Mar 9, 2006
- Samsung Electronics Co., Ltd.
- In-Ku Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for bonding a wire
- Publication number 20050200009
- Publication date Sep 15, 2005
- In-Ku Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor chip stack structure and method for forming the same
- Publication number 20030178710
- Publication date Sep 25, 2003
- Samsung Electronics Co., Ltd.
- In-Ku Kang
- H01 - BASIC ELECTRIC ELEMENTS