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Patents Grantslast 30 patents

Information Patent Grant
Package on package (PoP) device comprising thermal interface materi...
- Patent number 10,002,857
- Issue date Jun 19, 2018
- QUALCOMM Incorporated
- Michael James Solimando
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power management integrated circuit (PMIC) integration into a proce...
- Patent number 9,536,805
- Issue date Jan 3, 2017
- QUALCOMM Incorporated
- Siamak Fazelpour
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems, apparatus, and methods for heat dissipation
- Patent number 9,460,980
- Issue date Oct 4, 2016
- QUALCOMM Incorporated
- Sun Yun
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE ON PACKAGE (PoP) DEVICE COMPRISING THERMAL INTERFACE MATERI...
- Publication number 20170294422
- Publication date Oct 12, 2017
- QUALCOMM Incorporated
- Michael James Solimando
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXPOSED DIE MOLD UNDERFILL (MUF) WITH FINE PITCH COPPER (CU) PILLAR...
- Publication number 20170271175
- Publication date Sep 21, 2017
- QUALCOMM Incorporated
- Christopher James HEALY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS, APPARATUS, AND METHODS FOR HEAT DISSIPATION
- Publication number 20160240455
- Publication date Aug 18, 2016
- QUALCOMM Incorporated
- Sun YUN
- H01 - BASIC ELECTRIC ELEMENTS