Sunao FUKUTAKE

Person

Nagaokakyo-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Multilayer substrate
- Patent number 12,167,545
- Issue date Dec 10, 2024
- Murata Manufacturing Co., Ltd.
- Takayuki Shimamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface-treated copper foil, and copper-clad laminate and circuit b...
- Patent number 11,680,332
- Issue date Jun 20, 2023
- Furukawa Electric Co., Ltd.
- Takahiro Tsuruta
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Black liquid-crystal polymer film and multilayer board
- Patent number 11,365,353
- Issue date Jun 21, 2022
- Murata Manufacturing Co., Ltd.
- Yoshimasa Nishi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Metal-clad laminate, circuit board, and multilayer circuit board
- Patent number 10,959,330
- Issue date Mar 23, 2021
- Murata Manufacturing Co., Ltd.
- Kazuhiko Ohashi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Surface-treated copper foil, and copper-clad laminate and printed w...
- Patent number 10,701,811
- Issue date Jun 30, 2020
- Furukawa Electric Co., Ltd.
- Takeo Uno
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
MULTILAYER SUBSTRATE
- Publication number 20240359445
- Publication date Oct 31, 2024
- Murata Manufacturing Co., Ltd.
- Kosuke NISHIO
- B32 - LAYERED PRODUCTS
Information Patent Application
CIRCUIT BOARD AND MULTILAYER CIRCUIT BOARD
- Publication number 20230145378
- Publication date May 11, 2023
- Murata Manufacturing Co., Ltd.
- Takayuki SHIMAMURA
- B32 - LAYERED PRODUCTS
Information Patent Application
MULTILAYER SUBSTRATE
- Publication number 20230118261
- Publication date Apr 20, 2023
- Murata Manufacturing Co., Ltd.
- Takayuki SHIMAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SURFACE-TREATED COPPER FOIL, AND COPPER-CLAD LAMINATE AND CIRCUIT B...
- Publication number 20210212204
- Publication date Jul 8, 2021
- FURUKAWA ELECTRIC CO., LTD.
- Takahiro TSURUTA
- B32 - LAYERED PRODUCTS
Information Patent Application
SURFACE-TREATED COPPER FOIL, AND COPPER-CLAD LAMINATE AND PRINTED W...
- Publication number 20200029444
- Publication date Jan 23, 2020
- FURUKAWA ELECTRIC CO., LTD.
- Takeo UNO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BLACK LIQUID-CRYSTAL POLYMER FILM AND MULTILAYER BOARD
- Publication number 20190352565
- Publication date Nov 21, 2019
- Murata Manufacturing Co., Ltd.
- Yoshimasa NISHI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METAL-CLAD LAMINATE, CIRCUIT BOARD, AND MULTILAYER CIRCUIT BOARD
- Publication number 20190357355
- Publication date Nov 21, 2019
- Murata Manufacturing Co., Ltd.
- Kazuhiko Ohashi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Sunao FUKUTAKE

Person

Patents Grantslast 30 patents

Multilayer substrate

Surface-treated copper foil, and copper-clad laminate and circuit b...

Black liquid-crystal polymer film and multilayer board

Metal-clad laminate, circuit board, and multilayer circuit board

Surface-treated copper foil, and copper-clad laminate and printed w...

Patents Applicationslast 30 patents

MULTILAYER SUBSTRATE

CIRCUIT BOARD AND MULTILAYER CIRCUIT BOARD

MULTILAYER SUBSTRATE

SURFACE-TREATED COPPER FOIL, AND COPPER-CLAD LAMINATE AND CIRCUIT B...

SURFACE-TREATED COPPER FOIL, AND COPPER-CLAD LAMINATE AND PRINTED W...

BLACK LIQUID-CRYSTAL POLYMER FILM AND MULTILAYER BOARD

METAL-CLAD LAMINATE, CIRCUIT BOARD, AND MULTILAYER CIRCUIT BOARD