SUNDAR RAMAMURTHY

Person

Fremont, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Methods for forming low-resistance contacts through integrated proc...
- Patent number 9,947,578
- Issue date Apr 17, 2018
- Applied Materials, Inc.
- Yu Lei
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods for forming low resistivity interconnects
- Patent number 9,812,328
- Issue date Nov 7, 2017
- Applied Materials, Inc.
- Kaushal K. Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Managing thermal budget in annealing of substrates
- Patent number 9,595,459
- Issue date Mar 14, 2017
- Applied Materials, Inc.
- Stephen Moffatt
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Backside rapid thermal processing of patterned wafers
- Patent number 9,431,278
- Issue date Aug 30, 2016
- Applied Materials, Inc.
- Wolfgang Aderhold
- F27 - FURNACES KILNS OVENS RETORTS
Information Patent Grant
Method and apparatus for forming gate stack on Si, SiGe or Ge channels
- Patent number 9,373,516
- Issue date Jun 21, 2016
- Applied Materials, Inc.
- Khaled Z. Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Managing thermal budget in annealing of substrates
- Patent number 9,114,479
- Issue date Aug 25, 2015
- Applied Materials, Inc.
- Stephen Moffatt
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal reactor with improved gas flow distribution
- Patent number 8,888,916
- Issue date Nov 18, 2014
- Applied Materials, Inc.
- Ming-Kuei (Michael) Tseng
- F27 - FURNACES KILNS OVENS RETORTS
Information Patent Grant
Backside rapid thermal processing of patterned wafers
- Patent number 8,658,945
- Issue date Feb 25, 2014
- Applied Materials, Inc.
- Wolfgang Aderhold
- F27 - FURNACES KILNS OVENS RETORTS
Information Patent Grant
Thermal reactor with improved gas flow distribution
- Patent number 8,608,853
- Issue date Dec 17, 2013
- Applied Materials, Inc.
- Ming-Kuei (Michael) Tseng
- F27 - FURNACES KILNS OVENS RETORTS
Information Patent Grant
Processing multilayer semiconductors with multiple heat sources
- Patent number 8,536,492
- Issue date Sep 17, 2013
- Applied Materials, Inc.
- Sundar Ramamurthy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of thermally treating silicon with oxygen
- Patent number 8,497,193
- Issue date Jul 30, 2013
- Applied Materials, Inc.
- Yoshitaka Yokota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Water cooled gas injector
- Patent number 8,409,353
- Issue date Apr 2, 2013
- Applied Materials, Inc.
- Yoshitaka Yokota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Managing thermal budget in annealing of substrates
- Patent number 8,314,369
- Issue date Nov 20, 2012
- Applied Materials, Inc.
- Stephen Moffatt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal reactor with improved gas flow distribution
- Patent number 8,056,500
- Issue date Nov 15, 2011
- Applied Materials, Inc.
- Ming-Kuei (Michael) Tseng
- F27 - FURNACES KILNS OVENS RETORTS
Information Patent Grant
Processing multilayer semiconductors with multiple heat sources
- Patent number 7,986,871
- Issue date Jul 26, 2011
- Applied Materials, Inc.
- Sundar Ramamurthy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal oxidation of silicon using ozone
- Patent number 7,972,441
- Issue date Jul 5, 2011
- Applied Materials, Inc.
- Yoshitaka Yokota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pulsed laser anneal system architecture
- Patent number 7,923,660
- Issue date Apr 12, 2011
- Applied Materials, Inc.
- Alexander N. Lerner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of controlling metal silicide formation
- Patent number 7,811,877
- Issue date Oct 12, 2010
- Applied Materials, Inc.
- Sundar Ramamurthy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Edge temperature compensation in thermal processing particularly us...
- Patent number 7,700,376
- Issue date Apr 20, 2010
- Applied Materials, Inc.
- Juan Chacin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lamp array for thermal processing exhibiting improved radial unifor...
- Patent number 7,509,035
- Issue date Mar 24, 2009
- Applied Materials, Inc.
- Joseph M. Ranish
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Backside rapid thermal processing of patterned wafers
- Patent number 7,414,224
- Issue date Aug 19, 2008
- Applied Materials, Inc.
- Wolfgang Aderhold
- F27 - FURNACES KILNS OVENS RETORTS
Information Patent Grant
Cylinder for thermal processing chamber
- Patent number 7,241,345
- Issue date Jul 10, 2007
- Applied Materials, Inc.
- Sundar Ramamurthy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Tailored temperature uniformity
- Patent number 7,127,367
- Issue date Oct 24, 2006
- Applied Materials, Inc.
- Balasubramanian Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stepped reflector plate
- Patent number 7,041,931
- Issue date May 9, 2006
- Applied Materials, Inc.
- Dean Jennings
- F27 - FURNACES KILNS OVENS RETORTS
Information Patent Grant
Advances in spike anneal processes for ultra shallow junctions
- Patent number 6,897,131
- Issue date May 24, 2005
- Applied Materials, Inc.
- Balasubramanian Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally matched support ring for substrate processing chamber
- Patent number 6,888,104
- Issue date May 3, 2005
- Applied Materials, Inc.
- Joseph M. Ranish
- F27 - FURNACES KILNS OVENS RETORTS
Information Patent Grant
Thermally processing a substrate
- Patent number 6,803,546
- Issue date Oct 12, 2004
- Applied Materials, Inc.
- Ryan C Boas
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS FOR FORMING LOW-RESISTANCE CONTACTS THROUGH INTEGRATED PROC...
- Publication number 20170148670
- Publication date May 25, 2017
- Applied Materials, Inc.
- YU LEI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS FOR FORMING LOW RESISTIVITY INTERCONNECTS
- Publication number 20160372371
- Publication date Dec 22, 2016
- Applied Materials, Inc.
- Kaushal K. SINGH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANAGING THERMAL BUDGET IN ANNEALING OF SUBSTRATES
- Publication number 20150357215
- Publication date Dec 10, 2015
- Applied Materials, Inc.
- STEPHEN MOFFATT
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANAGING THERMAL BUDGET IN ANNEALING OF SUBSTRATES
- Publication number 20140209583
- Publication date Jul 31, 2014
- Applied Materials, Inc.
- Stephen MOFFATT
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL REACTOR WITH IMPROVED GAS FLOW DISTRIBUTION
- Publication number 20140079376
- Publication date Mar 20, 2014
- Applied Materials, Inc.
- Ming-Kuei (Michael) TSENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR FORMING GATE STACK ON Si, SiGe or Ge CHANNELS
- Publication number 20140065798
- Publication date Mar 6, 2014
- Khaled Z. Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING MULTILAYER SEMICONDUCTORS WITH MULTIPLE HEAT SOURCES
- Publication number 20140003800
- Publication date Jan 2, 2014
- Sundar RAMAMURTHY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL PLASMA SOURCE, LAMP HEATED PLASMA CHAMBER
- Publication number 20120222618
- Publication date Sep 6, 2012
- Applied Materials, Inc.
- Christopher Olsen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
INTEGRATED PLATFORM FOR IN-SITU DOPING AND ACTIVATION OF SUBSTRATES
- Publication number 20120088356
- Publication date Apr 12, 2012
- Applied Materials, Inc.
- KARTIK SANTHANAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL REACTOR WITH IMPROVED GAS FLOW DISTRIBUTION
- Publication number 20120058648
- Publication date Mar 8, 2012
- Ming-Kuei (Michael) Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Water cooled gas injector
- Publication number 20120031332
- Publication date Feb 9, 2012
- Applied Materials, Inc.
- Yoshitaka Yokota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of thermally treating silicon with oxygen
- Publication number 20110250764
- Publication date Oct 13, 2011
- Applied Materials, Inc.
- Yoshitaka Yokota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH THROUGHPUT SELECTIVE OXIDATION OF SILICON AND POLYSILICON USIN...
- Publication number 20100297854
- Publication date Nov 25, 2010
- Applied Materials, Inc.
- Sundar Ramamurthy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANAGING THERMAL BUDGET IN ANNEALING OF SUBSTRATES
- Publication number 20100065547
- Publication date Mar 18, 2010
- STEPHEN MOFFATT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANAGING THERMAL BUDGET IN ANNEALING OF SUBSTRATES
- Publication number 20100068898
- Publication date Mar 18, 2010
- STEPHEN MOFFATT
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL REACTOR WITH IMPROVED GAS FLOW DISTRIBUTION
- Publication number 20090163042
- Publication date Jun 25, 2009
- Applied Materials, Inc.
- Ming-Kuei (Michael) Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PULSED LASER ANNEAL SYSTEM ARCHITECTURE
- Publication number 20090045182
- Publication date Feb 19, 2009
- ALEXANDER N. LERNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Backside Rapid Thermal Processing of Patterned Wafers
- Publication number 20090041443
- Publication date Feb 12, 2009
- Wolfgang Aderhold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF CONTROLLING METAL SILICIDE FORMATION
- Publication number 20090023257
- Publication date Jan 22, 2009
- Applied Materials, Inc.
- SUNDAR RAMAMURTHY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING MULTILAYER SEMICONDUCTORS WITH MULTIPLE HEAT SOURCES
- Publication number 20090010626
- Publication date Jan 8, 2009
- SUNDAR RAMAMURTHY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROLLED ANNEALING METHOD
- Publication number 20080090309
- Publication date Apr 17, 2008
- JOSEPH MICHAEL RANISH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Backside rapid thermal processing of patterned wafers
- Publication number 20070104470
- Publication date May 10, 2007
- Wolfgang Aderhold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Thermally Oxidizing Silicon Using Ozone
- Publication number 20070026693
- Publication date Feb 1, 2007
- Applied Materials, Inc.
- Yoshitaka Yokota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate processing platform allowing processing in different ambi...
- Publication number 20060240680
- Publication date Oct 26, 2006
- APPLIED MATERIALS, INC.
- Yoshitaka Yokota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Edge temperature compensation in thermal processing particularly us...
- Publication number 20060228818
- Publication date Oct 12, 2006
- Applied Materials, Inc.
- Juan Chacin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal oxidation of silicon using ozone
- Publication number 20060223315
- Publication date Oct 5, 2006
- APPLIED MATERIALS, INC.
- Yoshitaka Yokota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lamp array for thermal processing exhibiting improved radial unifor...
- Publication number 20060066193
- Publication date Mar 30, 2006
- APPLIED MATERIALS, INC.
- Joseph M. Ranish
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Processing multilayer semiconductors with multiple heat sources
- Publication number 20060018639
- Publication date Jan 26, 2006
- Sundar Ramamurthy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Backside rapid thermal processing of patterned wafers
- Publication number 20050191044
- Publication date Sep 1, 2005
- APPLIED MATERIALS, INC.
- Wolfgang Aderhold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Tailored temperature uniformity
- Publication number 20050102108
- Publication date May 12, 2005
- Balasubramanian Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS

SUNDAR RAMAMURTHY

Person

Patents Grantslast 30 patents

Methods for forming low-resistance contacts through integrated proc...

Methods for forming low resistivity interconnects

Managing thermal budget in annealing of substrates

Backside rapid thermal processing of patterned wafers

Method and apparatus for forming gate stack on Si, SiGe or Ge channels

Managing thermal budget in annealing of substrates

Thermal reactor with improved gas flow distribution

Backside rapid thermal processing of patterned wafers

Thermal reactor with improved gas flow distribution

Processing multilayer semiconductors with multiple heat sources

Method of thermally treating silicon with oxygen

Water cooled gas injector

Managing thermal budget in annealing of substrates

Thermal reactor with improved gas flow distribution

Processing multilayer semiconductors with multiple heat sources

Thermal oxidation of silicon using ozone

Pulsed laser anneal system architecture

Method of controlling metal silicide formation

Edge temperature compensation in thermal processing particularly us...

Lamp array for thermal processing exhibiting improved radial unifor...

Backside rapid thermal processing of patterned wafers

Cylinder for thermal processing chamber

Tailored temperature uniformity

Stepped reflector plate

Advances in spike anneal processes for ultra shallow junctions

Thermally matched support ring for substrate processing chamber

Thermally processing a substrate

Patents Applicationslast 30 patents

METHODS FOR FORMING LOW-RESISTANCE CONTACTS THROUGH INTEGRATED PROC...

METHODS FOR FORMING LOW RESISTIVITY INTERCONNECTS

MANAGING THERMAL BUDGET IN ANNEALING OF SUBSTRATES

MANAGING THERMAL BUDGET IN ANNEALING OF SUBSTRATES

THERMAL REACTOR WITH IMPROVED GAS FLOW DISTRIBUTION

METHOD AND APPARATUS FOR FORMING GATE STACK ON Si, SiGe or Ge CHANNELS

PROCESSING MULTILAYER SEMICONDUCTORS WITH MULTIPLE HEAT SOURCES

DUAL PLASMA SOURCE, LAMP HEATED PLASMA CHAMBER

INTEGRATED PLATFORM FOR IN-SITU DOPING AND ACTIVATION OF SUBSTRATES

THERMAL REACTOR WITH IMPROVED GAS FLOW DISTRIBUTION

Water cooled gas injector

Method of thermally treating silicon with oxygen

HIGH THROUGHPUT SELECTIVE OXIDATION OF SILICON AND POLYSILICON USIN...

MANAGING THERMAL BUDGET IN ANNEALING OF SUBSTRATES

MANAGING THERMAL BUDGET IN ANNEALING OF SUBSTRATES

THERMAL REACTOR WITH IMPROVED GAS FLOW DISTRIBUTION

PULSED LASER ANNEAL SYSTEM ARCHITECTURE

Backside Rapid Thermal Processing of Patterned Wafers

METHOD OF CONTROLLING METAL SILICIDE FORMATION

PROCESSING MULTILAYER SEMICONDUCTORS WITH MULTIPLE HEAT SOURCES

CONTROLLED ANNEALING METHOD

Backside rapid thermal processing of patterned wafers

Method of Thermally Oxidizing Silicon Using Ozone

Substrate processing platform allowing processing in different ambi...

Edge temperature compensation in thermal processing particularly us...

Thermal oxidation of silicon using ozone

Lamp array for thermal processing exhibiting improved radial unifor...

Processing multilayer semiconductors with multiple heat sources

Backside rapid thermal processing of patterned wafers

Tailored temperature uniformity