Sung-Chuan MA

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Hong Kong, HK

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Patents Grantslast 30 patents

Information Patent Grant
Chip package structure with ENIG plating
- Patent number 8,937,386
- Issue date Jan 20, 2015
- AFlash Technology Co., Ltd
- Tse-Ming Chu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGE STRUCTURE
- Publication number 20120196438
- Publication date Aug 2, 2012
- Tse-Ming CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit connecting structure having flexible layout
- Publication number 20100244200
- Publication date Sep 30, 2010
- Chu, Tse Ming
- Tse Ming Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE
- Publication number 20100133686
- Publication date Jun 3, 2010
- Tse-Ming CHU
- H01 - BASIC ELECTRIC ELEMENTS