TREA

Sung-Hung CHIANG

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  • Kaohsiung, TW
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Patents Grantslast 30 patents

  • Information Patent Grant

    Semiconductor device package
    • Patent number 12,165,984
    • Issue date Dec 10, 2024
    • Advanced Semiconductor Engineering, Inc.
    • Hao-Chih Hsieh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor device package
    • Patent number 11,776,863
    • Issue date Oct 3, 2023
    • Advanced Semiconductor Engineering, Inc.
    • Hao-Chih Hsieh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor device package
    • Patent number 11,437,322
    • Issue date Sep 6, 2022
    • Advanced Semiconductor Engineering, Inc.
    • Hao-Chih Hsieh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor device package
    • Patent number 11,094,602
    • Issue date Aug 17, 2021
    • Advanced Semiconductor Engineering, Inc.
    • Hao-Chih Hsieh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor device package including filling mold via
    • Patent number 10,381,300
    • Issue date Aug 13, 2019
    • Advanced Semiconductor Engineering, Inc.
    • Jen-Chieh Kao
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    SEMICONDUCTOR DEVICE PACKAGE
    • Publication number 20220415810
    • Publication date Dec 29, 2022
    • Advanced Semiconductor Engineering, Inc.
    • Hao-Chih HSIEH
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE PACKAGE
    • Publication number 20210375706
    • Publication date Dec 2, 2021
    • Advanced Semiconductor Engineering, Inc.
    • Hao-Chih HSIEH
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE PACKAGE
    • Publication number 20210043527
    • Publication date Feb 11, 2021
    • Advanced Semiconductor Engineering, Inc.
    • Hao-Chih HSIEH
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE PACKAGE
    • Publication number 20200083172
    • Publication date Mar 12, 2020
    • Advanced Semiconductor Engineering, Inc.
    • Hao-Chih HSIEH
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE PACKAGE INCLUDING FILLING MOLD VIA
    • Publication number 20180151485
    • Publication date May 31, 2018
    • Advanced Semiconductor Engineering, Inc.
    • Jen-Chieh KAO
    • H01 - BASIC ELECTRIC ELEMENTS