Sung-Jin Kim

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Hsin-Chu, TW

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Patents Grantslast 30 patents

Information Patent Grant
Microplasma devices excited by interdigitated electrodes
- Patent number 7,511,426
- Issue date Mar 31, 2009
- The Board of Trustees of the University of Illinois
- J. Gary Eden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for solder joint
- Patent number 7,224,073
- Issue date May 29, 2007
- Ultratera Corporation
- Sung-Jin Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating window ball grid array semiconductor package
- Patent number 7,122,407
- Issue date Oct 17, 2006
- Ultra Tera Corporation
- Sung-Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Microplasma devices excited by interdigitated electrodes
- Publication number 20060038490
- Publication date Feb 23, 2006
- THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
- J. Gary Eden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor molding method and structure
- Publication number 20050258552
- Publication date Nov 24, 2005
- Sung Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate for solder joint
- Publication number 20050258544
- Publication date Nov 24, 2005
- Sung-Jin Kim
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method for fabricating window ball grid array semiconductor package
- Publication number 20050208707
- Publication date Sep 22, 2005
- UltraTera Corporation
- Sung-Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS