Sung Kim

Person

Pflugerville, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure with a titanium aluminum nitride layer and...
- Patent number 6,552,431
- Issue date Apr 22, 2003
- Micron Technology, Inc.
- Scott G. Meikle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having interconnects on a projecting region...
- Patent number 6,274,897
- Issue date Aug 14, 2001
- Micron Technology, Inc.
- Guy Blalock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with a titanium aluminum nitride layer and...
- Patent number 6,239,492
- Issue date May 29, 2001
- Micron Technology, Inc.
- Scott G. Meikle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of chemical mechanical polishing
- Patent number 6,234,877
- Issue date May 22, 2001
- Micron Technology, Inc.
- Daniel A. Koos
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor structure with a titanium aluminum nitride layer and...
- Patent number 6,218,295
- Issue date Apr 17, 2001
- Micron Technology, Inc.
- Scott G. Meikle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing for polishing dissimilar conductive layers in a semicond...
- Patent number 6,204,169
- Issue date Mar 20, 2001
- Motorola Inc.
- Rajeev Bajaj
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of chemical mechanical polishing
- Patent number 6,120,354
- Issue date Sep 19, 2000
- Micron Technology, Inc.
- Daniel A. Koos
- B24 - GRINDING POLISHING
Information Patent Grant
Processing for polishing dissimilar conductive layers in a semicond...
- Patent number 5,985,755
- Issue date Nov 16, 1999
- Rajeev Bajaj
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for forming a semiconductor device
- Patent number 5,961,373
- Issue date Oct 5, 1999
- Motorola, Inc.
- Lei Ping Lai
- B24 - GRINDING POLISHING
Information Patent Grant
Method for reducing the heights of interconnects on a projecting re...
- Patent number 5,945,348
- Issue date Aug 31, 1999
- Micron Technology, Inc.
- Guy Blalock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of chemical mechanical polishing
- Patent number 5,934,980
- Issue date Aug 10, 1999
- Micron Technology, Inc.
- Daniel A. Koos
- B24 - GRINDING POLISHING
Information Patent Grant
Process for polishing a semiconductor device substrate
- Patent number 5,916,011
- Issue date Jun 29, 1999
- Motorola, Inc.
- Sung C. Kim
- B24 - GRINDING POLISHING
Information Patent Grant
Method of chemical mechanical polishing (CMP) using an underpad wit...
- Patent number 5,899,745
- Issue date May 4, 1999
- Motorola, Inc.
- Sung C. Kim
- B24 - GRINDING POLISHING
Information Patent Grant
Sputtering with collinator cleaning within the sputtering chamber
- Patent number 5,409,587
- Issue date Apr 25, 1995
- Micron Technology, Inc.
- Gurtej S. Sandhu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for shaping features of a semiconductor structure using chem...
- Patent number 5,302,233
- Issue date Apr 12, 1994
- Micron Semiconductor, Inc.
- Sung C. Kim
- B24 - GRINDING POLISHING
Information Patent Grant
Process for depositing aluminum nitride (AlN) using nitrogen plasma...
- Patent number 5,270,263
- Issue date Dec 14, 1993
- Micron Technology, Inc.
- Sung C. Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Titanium/aluminum/nitrogen material for semiconductor devices
- Patent number 5,231,306
- Issue date Jul 27, 1993
- Micron Technology, Inc.
- Scott G. Meikle
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method of chemical mechanical polishing
- Publication number 20010055941
- Publication date Dec 27, 2001
- Micron Technology, Inc.
- Daniel A. Koos
- B24 - GRINDING POLISHING
Information Patent Application
Semiconductor structure with a titanium aluminum nitride layer and...
- Publication number 20010040293
- Publication date Nov 15, 2001
- Micron Technology, Inc.
- Scott G. Meikle
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Semiconductor structure with a titanium aluminum nitride layer and...

Semiconductor structure having interconnects on a projecting region...

Semiconductor structure with a titanium aluminum nitride layer and...

Method of chemical mechanical polishing

Semiconductor structure with a titanium aluminum nitride layer and...

Processing for polishing dissimilar conductive layers in a semicond...

Method of chemical mechanical polishing

Processing for polishing dissimilar conductive layers in a semicond...

Process for forming a semiconductor device

Method for reducing the heights of interconnects on a projecting re...

Method of chemical mechanical polishing

Process for polishing a semiconductor device substrate

Method of chemical mechanical polishing (CMP) using an underpad wit...

Sputtering with collinator cleaning within the sputtering chamber

Method for shaping features of a semiconductor structure using chem...

Process for depositing aluminum nitride (AlN) using nitrogen plasma...

Titanium/aluminum/nitrogen material for semiconductor devices

Patents Applicationslast 30 patents

Method of chemical mechanical polishing

Semiconductor structure with a titanium aluminum nitride layer and...