Sung-Kun LIN

Person

Nanjing City, CN

People

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250192014
- Publication date Jun 12, 2025
- AaltoSemi Inc.
- Yin-Ju CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20250159800
- Publication date May 15, 2025
- AaltoSemi Inc.
- Min-Yao CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE SUBSTRATE AND FABRICATING METHOD THEREOF
- Publication number 20250096105
- Publication date Mar 20, 2025
- AaltoSemi Inc.
- Min-Yao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20250087572
- Publication date Mar 13, 2025
- AaltoSemi Inc.
- Yin-Ju CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20250022723
- Publication date Jan 16, 2025
- AaltoSemi Inc.
- Min-Yao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE
- Publication number 20240096776
- Publication date Mar 21, 2024
- AaltoSemi Inc.
- Andrew C. CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF PACKAGE SUBSTRATE
- Publication number 20240021438
- Publication date Jan 18, 2024
- AaltoSemi Inc.
- Andrew C. CHANG
- H01 - BASIC ELECTRIC ELEMENTS

Sung-Kun LIN

Person

Patents Applicationslast 30 patents

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF

PACKAGE SUBSTRATE AND FABRICATING METHOD THEREOF

ELECTRONIC PACKAGE AND FABRICATING METHOD THEREOF

ELECTRONIC PACKAGE AND FABRICATING METHOD THEREOF

PACKAGE SUBSTRATE

MANUFACTURING METHOD OF PACKAGE SUBSTRATE