Sung Kwon Kang

Person

Chappagua, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Substrate via filling
- Patent number 9,872,394
- Issue date Jan 16, 2018
- International Business Machines Corporation
- Steven A. Cordes
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Axiocentric scrubbing land grid array contacts and methods for fabr...
- Patent number 9,565,759
- Issue date Feb 7, 2017
- GLOBALFOUNDRIES Inc.
- Gareth Hougham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate via filling
- Patent number 9,433,101
- Issue date Aug 30, 2016
- International Business Machines Corporation
- Steven A. Cordes
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electromigration-resistant lead-free solder interconnect structures
- Patent number 9,379,007
- Issue date Jun 28, 2016
- Globalfoundries Inc.
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromigration-resistant under-bump metallization of nickel-iron...
- Patent number 9,082,762
- Issue date Jul 14, 2015
- International Business Machines Corporation
- Sung K. Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Axiocentric scrubbing land grid array contacts and methods for fabr...
- Patent number 9,040,841
- Issue date May 26, 2015
- International Business Machines Corporation
- Gareth Hougham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Prevention and control of intermetallic alloy inclusions that form...
- Patent number 8,691,685
- Issue date Apr 8, 2014
- International Business Machines Corporation
- Sung Kwon Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Prevention and control of intermetallic alloy inclusions
- Patent number 8,679,964
- Issue date Mar 25, 2014
- International Business Machines Corporation
- Sung Kwon Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multipath soldered thermal interface between a chip and its heat sink
- Patent number 8,679,899
- Issue date Mar 25, 2014
- International Business Machines Corporation
- George Liang-Tai Chiu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Interconnections for flip-chip using lead-free solders and having i...
- Patent number 8,314,500
- Issue date Nov 20, 2012
- Ultratech, Inc.
- Luc Belanger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Axiocentric scrubbing land grid array contacts and methods for fabr...
- Patent number 8,263,879
- Issue date Sep 11, 2012
- International Business Machines Corporation
- Gareth Hougham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Modification of solder alloy compositions to suppress interfacial v...
- Patent number 8,157,158
- Issue date Apr 17, 2012
- International Business Machines Corporation
- Peter A. Gruber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnections for flip-chip using lead-free solders and having r...
- Patent number 8,026,613
- Issue date Sep 27, 2011
- International Business Machines Corporation
- Keith E. Fogel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection for flip-chip using lead-free solders and having im...
- Patent number 7,932,169
- Issue date Apr 26, 2011
- International Business Machines Corporation
- Luc Belanger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnections for flip-chip using lead-free solders and having r...
- Patent number 7,923,849
- Issue date Apr 12, 2011
- International Business Machines Corporation
- Keith E. Fogel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices and methods
- Patent number 7,820,488
- Issue date Oct 26, 2010
- International Business Machines Corporation
- Sri M. Sri-Jayantha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Centrifugal method for filing high aspect ratio blind mirco vias po...
- Patent number 7,815,968
- Issue date Oct 19, 2010
- International Business Machines Corporation
- Gareth Hougham
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Method and process for reducing undercooling in a lead-free tin-ric...
- Patent number 7,784,669
- Issue date Aug 31, 2010
- International Business Machines Corporation
- Gareth G. Hougham
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and process for reducing undercooling in a lead-free tin-ric...
- Patent number 7,703,661
- Issue date Apr 27, 2010
- International Business Machines Corporation
- Gareth G. Hougham
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder interconnect structure and method using injection molded solder
- Patent number 7,523,852
- Issue date Apr 28, 2009
- International Business Machines Corporation
- Stephen L. Buchwalter
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrically conducting adhesives for via fill applications
- Patent number 7,467,742
- Issue date Dec 23, 2008
- International Business Machines Corporation
- Jeffrey Donald Gelorme
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Centrifugal method for filing high aspect ratio blind micro vias wi...
- Patent number 7,452,568
- Issue date Nov 18, 2008
- International Business Machines Corporation
- Gareth Hougham
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Interconnections for flip-chip using lead-free solders and having r...
- Patent number 7,410,833
- Issue date Aug 12, 2008
- International Business Machines Corporation
- Keith E. Fogel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices and methods
- Patent number 7,329,948
- Issue date Feb 12, 2008
- International Business Machines Corporation
- Sri M. Sri-Jayantha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball limiting metallurgy, interconnection structure including the s...
- Patent number 7,273,803
- Issue date Sep 25, 2007
- International Business Machines Corporation
- Yu-Ting Cheng
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method to selectively cap interconnects with indium or tin bronzes...
- Patent number 7,115,996
- Issue date Oct 3, 2006
- International Business Machines Corporation
- Daniel C. Edelstein
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fluidic cooling systems and methods for electronic components
- Patent number 7,079,393
- Issue date Jul 18, 2006
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display fabrication using modular active devices
- Patent number 6,879,098
- Issue date Apr 12, 2005
- International Business Machines Corporation
- Stephen L. Buchwalter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead-free tin-silver-copper alloy solder composition
- Patent number 6,805,974
- Issue date Oct 19, 2004
- International Business Machines Corporation
- Won K. Choi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method to selectively cap interconnects with indium or tin bronzes...
- Patent number 6,784,088
- Issue date Aug 31, 2004
- International Business Machines Corporation
- Daniel C. Edelstein
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE VIA FILLING
- Publication number 20160219715
- Publication date Jul 28, 2016
- International Business Machines Corporation
- Steven A. Cordes
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE VIA FILLING
- Publication number 20160113119
- Publication date Apr 21, 2016
- International Business Machines Corporation
- Steven A. Cordes
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
AXIOCENTRIC SCRUBBING LAND GRID ARRAY CONTACTS AND METHODS FOR FABR...
- Publication number 20150334830
- Publication date Nov 19, 2015
- International Business Machines Corporation
- Gareth Hougham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMIGRATION-RESISTANT LEAD-FREE SOLDER INTERCONNECT STRUCTURES
- Publication number 20130249066
- Publication date Sep 26, 2013
- International Business Machines Corporation
- CHARLES L. ARVIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMIGRATION-RESISTANT LEAD-FREE SOLDER INTERCONNECT STRUCTURES
- Publication number 20130252418
- Publication date Sep 26, 2013
- International Business Machines Corporation
- CHARLES L. ARVIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AXIOCENTRIC SCRUBBING LAND GRID ARRAY CONTACTS AND METHODS FOR FABR...
- Publication number 20120325541
- Publication date Dec 27, 2012
- International Business Machines Corporation
- Gareth Hougham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODIFICATION OF SOLDER ALLOY COMPOSITIONS TO SUPPRESS INTERFACIAL V...
- Publication number 20120205425
- Publication date Aug 16, 2012
- Peter A. Gruber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODIFICATION OF SOLDER ALLOY COMPOSITIONS TO SUPPRESS INTERFACIAL V...
- Publication number 20120201596
- Publication date Aug 9, 2012
- Peter A. Gruber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING R...
- Publication number 20120012642
- Publication date Jan 19, 2012
- Keith E. Fogel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multipath Soldered Thermal Interface Between a Chip and its Heat Sink
- Publication number 20120006885
- Publication date Jan 12, 2012
- International Business Machines Corporation
- George Liang-Tai Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMIGRATION-RESISTANT UNDER-BUMP METALLIZATION OF NICKEL-IRON...
- Publication number 20110156256
- Publication date Jun 30, 2011
- International Business Machines Corporation
- Sung K. Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AXIOCENTRIC SCRUBBING LAND GRID ARRAY CONTACTS AND METHODS FOR FABR...
- Publication number 20110108316
- Publication date May 12, 2011
- International Business Machines Corporation
- Gareth Hougham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND PROCESS FOR REDUCING UNDERCOOLING IN A LEAD-FREE TIN-RIC...
- Publication number 20100155456
- Publication date Jun 24, 2010
- International Business Machines Corp.
- GARETH G. HOUGHAM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Interconnection for flip-chip using lead-free solders and having im...
- Publication number 20100062597
- Publication date Mar 11, 2010
- Luc Belanger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODIFICATION OF PB-FREE SOLDER ALLOY COMPOSITIONS TO IMPROVE INTERL...
- Publication number 20090197103
- Publication date Aug 6, 2009
- Da-Yuan Shih
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODIFICATION OF PB-FREE SOLDER ALLOY COMPOSITIONS TO IMPROVE INTERL...
- Publication number 20090197114
- Publication date Aug 6, 2009
- Da-Yuan Shih
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CENTRIFUGAL METHOD FOR FILING HIGH ASPECT RATIO BLIND MICRO VIAS WI...
- Publication number 20090032962
- Publication date Feb 5, 2009
- International Business Machines Corporation (Yorktown)
- Gareth Hougham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Prevention and Control of Intermetallic Alloy Inclusions
- Publication number 20080293243
- Publication date Nov 27, 2008
- International Business Machines Corporation
- Sung Kwon Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND PROCESS FOR REDUCING UNDERCOOLING IN A LEAD-FREE TIN-RIC...
- Publication number 20080290142
- Publication date Nov 27, 2008
- International Business Machines Corporation
- Gareth G. Hougham
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multipath Soldered Thermal Interface Between a Chip and its Heat Sink
- Publication number 20080274349
- Publication date Nov 6, 2008
- International Business Machines Corporation
- George Liang-Tai Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING R...
- Publication number 20080206979
- Publication date Aug 28, 2008
- Keith E. Fogel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING R...
- Publication number 20080203585
- Publication date Aug 28, 2008
- Keith E. Fogel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING R...
- Publication number 20080202792
- Publication date Aug 28, 2008
- Keith E. Fogel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODIFICATION OF SOLDER ALLOY COMPOSITIONS TO SUPPRESS INTERFACIAL V...
- Publication number 20080182124
- Publication date Jul 31, 2008
- International Business Machines Corporation
- Peter A. Gruber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING I...
- Publication number 20080157395
- Publication date Jul 3, 2008
- Luc Belanger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic Devices and Methods
- Publication number 20080064143
- Publication date Mar 13, 2008
- Sri M. Sri-Jayantha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multipath soldered thermal interface between a chip and its heat sink
- Publication number 20080038871
- Publication date Feb 14, 2008
- George Liang-Tai Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ball Limiting Metallurgy, Interconnection Structure Including the S...
- Publication number 20080008900
- Publication date Jan 10, 2008
- Yu-Ting Cheng
- B32 - LAYERED PRODUCTS
Information Patent Application
Prevention and control of intermetallic alloy inclusions that form...
- Publication number 20070166994
- Publication date Jul 19, 2007
- Sung Kwon Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Centrifugal method for filing high aspect ratio blind micro vias wi...
- Publication number 20060177568
- Publication date Aug 10, 2006
- International Business Machines Corporation
- Gareth Hougham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Sung Kwon Kang

Person

Patents Grantslast 30 patents

Substrate via filling

Axiocentric scrubbing land grid array contacts and methods for fabr...

Substrate via filling

Electromigration-resistant lead-free solder interconnect structures

Electromigration-resistant under-bump metallization of nickel-iron...

Axiocentric scrubbing land grid array contacts and methods for fabr...

Prevention and control of intermetallic alloy inclusions that form...

Prevention and control of intermetallic alloy inclusions

Multipath soldered thermal interface between a chip and its heat sink

Interconnections for flip-chip using lead-free solders and having i...

Axiocentric scrubbing land grid array contacts and methods for fabr...

Modification of solder alloy compositions to suppress interfacial v...

Interconnections for flip-chip using lead-free solders and having r...

Interconnection for flip-chip using lead-free solders and having im...

Interconnections for flip-chip using lead-free solders and having r...

Microelectronic devices and methods

Centrifugal method for filing high aspect ratio blind mirco vias po...

Method and process for reducing undercooling in a lead-free tin-ric...

Method and process for reducing undercooling in a lead-free tin-ric...

Solder interconnect structure and method using injection molded solder

Electrically conducting adhesives for via fill applications

Centrifugal method for filing high aspect ratio blind micro vias wi...

Interconnections for flip-chip using lead-free solders and having r...

Microelectronic devices and methods

Ball limiting metallurgy, interconnection structure including the s...

Method to selectively cap interconnects with indium or tin bronzes...

Fluidic cooling systems and methods for electronic components

Display fabrication using modular active devices

Lead-free tin-silver-copper alloy solder composition

Method to selectively cap interconnects with indium or tin bronzes...

Patents Applicationslast 30 patents

SUBSTRATE VIA FILLING

SUBSTRATE VIA FILLING

AXIOCENTRIC SCRUBBING LAND GRID ARRAY CONTACTS AND METHODS FOR FABR...

ELECTROMIGRATION-RESISTANT LEAD-FREE SOLDER INTERCONNECT STRUCTURES

ELECTROMIGRATION-RESISTANT LEAD-FREE SOLDER INTERCONNECT STRUCTURES

AXIOCENTRIC SCRUBBING LAND GRID ARRAY CONTACTS AND METHODS FOR FABR...

MODIFICATION OF SOLDER ALLOY COMPOSITIONS TO SUPPRESS INTERFACIAL V...

MODIFICATION OF SOLDER ALLOY COMPOSITIONS TO SUPPRESS INTERFACIAL V...

INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING R...

Multipath Soldered Thermal Interface Between a Chip and its Heat Sink

ELECTROMIGRATION-RESISTANT UNDER-BUMP METALLIZATION OF NICKEL-IRON...

AXIOCENTRIC SCRUBBING LAND GRID ARRAY CONTACTS AND METHODS FOR FABR...

METHOD AND PROCESS FOR REDUCING UNDERCOOLING IN A LEAD-FREE TIN-RIC...

Interconnection for flip-chip using lead-free solders and having im...

MODIFICATION OF PB-FREE SOLDER ALLOY COMPOSITIONS TO IMPROVE INTERL...

MODIFICATION OF PB-FREE SOLDER ALLOY COMPOSITIONS TO IMPROVE INTERL...

CENTRIFUGAL METHOD FOR FILING HIGH ASPECT RATIO BLIND MICRO VIAS WI...

Prevention and Control of Intermetallic Alloy Inclusions

METHOD AND PROCESS FOR REDUCING UNDERCOOLING IN A LEAD-FREE TIN-RIC...

Multipath Soldered Thermal Interface Between a Chip and its Heat Sink

INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING R...

INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING R...

INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING R...

MODIFICATION OF SOLDER ALLOY COMPOSITIONS TO SUPPRESS INTERFACIAL V...

INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING I...

Microelectronic Devices and Methods

Multipath soldered thermal interface between a chip and its heat sink

Ball Limiting Metallurgy, Interconnection Structure Including the S...

Prevention and control of intermetallic alloy inclusions that form...

Centrifugal method for filing high aspect ratio blind micro vias wi...